Abstract: A backside power and ground distribution network is formed on an semiconductor wafer having a decoupling capacitor on a backside of the semiconductor substrate layer by selectively etching a TSV openings through the decoupling capacitor and the backside of the semiconductor substrate layer to contact integrated device connection features and then forming, in the TSV openings, a ground TSV conductor which provides a direct electrical connection between the first capacitor plate and a first integrated device connection feature formed in the semiconductor substrate layer and also forming a power TSV conductor which provides a direct electrical connection between the second capacitor plate and a second integrated device connection feature formed in the semiconductor substrate layer, where the ground TSV conductor is not directly, electrically connected to the second capacitor plate, and where the power TSV conductor is not directly, electrically connected to the first capacitor plate.

Abstract: One or more electrical interconnects are formed beneath a device region within a volume of semiconductor material in which electronic devices are formed. The buried interconnects extended in a lateral direction parallel to surfaces of the die toward an edge of the semiconductor die. Such buried interconnects can be exposed at edges of the die to provide electrical contacts along those edges and can be coupled to electronic devices formed within the device region as alternatives to or in addition to contacts formed on top or bottom surfaces of the die.

Abstract: A CMOS circuit including a substrate of a first conductivity type with an emitter of a second conductivity type formed on a surface of the substrate, a well tie of the first conductivity type formed between trigger regions and the emitter comprising a strip of heavier doping coupled to a supply-voltage reference, and a well-tie extension including a deep lateral implant of the first conductivity type that overlaps a portion of the well tie. The deep lateral implant may have a degenerate level of doping. The deep lateral implant may be extended to form a guard-ring surrounding the emitter. Also, a deep implant of the first conductivity type may be formed at a lower portion of a body of the substrate that overlaps at least a portion of a lower extent of the deep lateral implant. The well tie may be extended to form a deep-profile guard-ring surrounding the emitter.

Abstract: A method for forming features on a wafer that includes forming a first opening in a first layer over a layer including carbon and removing material of the layer including carbon through the first opening to form a cavity. The method includes forming spacer material on the sidewalls of the layer including carbon in the cavity with a material forming process, wherein the spacer material is inhibited from forming on the bottom surface portion of the cavity during the material forming process. The formed spacer material formed a spacer that defines a second opening that is has a smaller lateral dimension in a first lateral direction than the first opening.

Abstract: Disclosed herein are methods for treating or preventing ophthalmic and dermatologic conditions in a patient, including ocular surface conditions such as blepharitis. The methods can include topically administering directly to an ocular surface of one or more eyes of a patient in need of treatment thereof an effective amount of an isoxazoline parasiticide, formamidine parasiticide, or other active ingredient, formulated into an ophthalmic composition, the ophthalmic composition further comprising a pharmaceutically acceptable vehicle. Compositions are also disclosed.

Abstract: A stimulation system stimulates anatomical targets in a patient for treatment of dry eye. The system may include a controller and a microstimulator. The controller may be implemented externally to or internally within the microstimulator. The components of the controller and microstimulator may be implemented in a single unit or in separate devices. When implemented separately, the controller and microstimulator may communicate wirelessly or via a wired connection. The microstimulator may generate pulses from a controller signal and apply the signal via one or more electrodes to an anatomical target. The microstimulator may not have any intelligence or logic to shape or modify a signal. The microstimulator may be a passive device configured to generate a pulse based on a signal received from the controller. The microstimulator may shape or modify a signal. Waveforms having different frequency, amplitude and period characteristics may stimulate different anatomical targets in a patient.

Abstract: Disclosed herein are systems and methods for electrically modulating tissue. Systems can include a current generator; at least one implantable working electrode, the at least one implantable working electrode configured to be in electrical communication with the current generator; at least one indifferent electrode; and a controller configured to signal the current generator to: generate a set of currents with a set of initial polarities to be delivered to the working electrodes; and wherein the at least one indifferent electrode absorbs a bias current which is equal in magnitude and opposite in polarity to a summation of the set of currents.

Abstract: An integrated circuit includes a dielectric layer located over one or more metal interconnect layers. The dielectric layer includes selective regions of implanted stress-setting dopants to provide different stress profiles in the dielectric layer to counteract the stress imparted from package structures. Accordingly, the effect of the stress imparted by package structures in a substrate can be negated by the placement of stress-setting dopants in selective areas of the dielectric layer.

Abstract: A back-end-of-line integrated circuit interconnect device is formed on an integrated circuit structure having a first dielectric layer formed over a first conductive contact layer by forming an interconnect opening in the first dielectric layer which exposes at least a portion of the first conductive contact layer, filling the interconnect opening in the first dielectric layer with one or more polyimide layers in contact the first conductive contact layer; and applying a laser light source to directly convert the one or more polyimide layers to form a graphene interconnect structure in the first dielectric layer which is directly, electrically connected to the first conductive contact layer.

Abstract: A back-end-of-line integrated circuit is formed on an integrated circuit structure having one or more polymer interlayer dielectric (ILD) layers formed over a first conductive wiring line layer by selectively processing an exposed portion of the one or more polymer ILD layers with application irradiation from a laser or light source to form a graphene interconnect structure in the one or more polymer ILD layers which is directly, electrically connected to the first conductive wiring line layer.

Abstract: An integrated circuit includes a compressive stressor and a tensile stressor, each located directly over an active region of a transistor, where a portion of the compressive stressor and a portion of the tensile stressor directly overlap with each other. In some embodiments, utilizing a compressive stressor and tensile stressor located directly over an active region with overlapping portions may allow for an adjustment of the stress applied to a channel region of a transistor to compensate for stress imparted by package structures.

Abstract: A manual opening mechanism for use with an isolation switch of a circuit interrupter is fully integrated into the circuit interrupter. The manual opening mechanism includes a rotating handle that is accessible from the front panel of the circuit interrupter. Rotating the handle applies force to the centerline of the isolation switch drive shaft, which prevents uneven loading and thus optimizes robustness during manual opening of the isolation switch. In addition, the handle has an ergonomic design, and is proportioned to minimize the force that an operator must apply to the handle in order to open the isolation switch.

Abstract: Disclosed herein are methods for treating or preventing ophthalmic and dermatologic conditions in a patient, including ocular surface conditions such as blepharitis. The methods can include topically administering directly to an ocular surface of one or more eyes of a patient in need of treatment thereof an effective amount of an isoxazoline parasiticide, formamidine parasiticide, or other active ingredient, formulated into an ophthalmic composition, the ophthalmic composition further comprising a pharmaceutically acceptable vehicle. Compositions are also disclosed.

Abstract: Described here are devices, systems, and methods for treating one or more conditions (such as dry eye) or improving ocular health by providing stimulation to nasal or sinus tissue. Generally, the devices may be handheld or implantable. In some variations, the handheld devices may have a stimulator body and a stimulator probe having one or more nasal insertion prongs. When the devices and systems are used to treat dry eye, nasal or sinus tissue may be stimulated to increase tear production, reduce the symptoms of dry eye, and/or improve ocular surface health.

Abstract: Disclosed herein are methods for treating or preventing ophthalmic and dermatologic conditions in a patient, including ocular surface conditions such as blepharitis. The methods can include topically administering directly to an ocular surface of one or more eyes of a patient in need of treatment thereof an effective amount of an isoxazoline parasiticide, formamidine parasiticide, or other active ingredient, formulated into an ophthalmic composition, the ophthalmic composition further comprising a pharmaceutically acceptable vehicle. Compositions are also disclosed.

Abstract: Described herein are methods and pharmaceutical formulations for treating ocular conditions.

Abstract: Disclosed herein are methods for treating or preventing ophthalmic and dermatologic conditions in a patient, including ocular surface conditions such as blepharitis. The methods can include topically administering directly to an ocular surface of one or more eyes of a patient in need of treatment thereof an effective amount of an isoxazoline parasiticide, formamidine parasiticide, or other active ingredient, formulated into an ophthalmic composition, the ophthalmic composition further comprising a pharmaceutically acceptable vehicle. Compositions are also disclosed.

Abstract: Mechanisms are provided for identifying vulnerability chains in a computing system. Computer system vulnerability characteristics for a plurality of computer system vulnerabilities from a vulnerability registry are retrieved. For each vulnerability, a threat score is calculated indicating a level of risk of the vulnerability to security of the computing system. Based on the vulnerability characteristics and the threat score, a directed acyclic graph (DAG) data structure is generated having a plurality of vulnerability chains, each vulnerability chain having a plurality of vulnerabilities, represented as nodes of the DAG, linked to each other from a root node to a terminating node. Links of the DAG have weights corresponding to a function of the threat scores of the nodes directly connected by the link. A graphical representation of the DAG is generated that depicts the weights of the links to thereby represent relative threat of the vulnerabilities linked by the links.