Abstract: A computer implemented system and method is provided for generating a layout of the cell defining a circuit component, the layout providing a layout pattern for a target process technology. The method comprises obtaining an archetype layout providing a valid layout pattern for the cell having regard to design rules of the target process technology, and receiving an input data file providing a process technology independent schematic of the circuit component for which the cell is to be generated. A schematic sizing operation is then performed on the input data file, having regard to both schematic constraints applicable to the target process technology and layout constraints derived from the archetype layout, in order to generate an output data file providing a process technology dependent schematic of the circuit component. A cell generation operation is then performed using the output data file and layout data determined from the archetype layout in order to generate the layout of the cell.

Abstract: A computer implemented system and method is provided for generating a layout of the cell defining a circuit component, the layout providing a layout pattern for a target process technology. The method comprises obtaining an archetype layout providing a valid layout pattern for the cell having regard to design rules of the target process technology, and receiving an input data file providing a process technology independent schematic of the circuit component for which the cell is to be generated. A schematic sizing operation is then performed on the input data file, having regard to both schematic constraints applicable to the target process technology and layout constraints derived from the archetype layout, in order to generate an output data file providing a process technology dependent schematic of the circuit component. A cell generation operation is then performed using the output data file and layout data determined from the archetype layout in order to generate the layout of the cell.

Abstract: A reflow oven used to join electronic components to a substrate includes a chamber housing having surfaces that are in contact with heated air mixed with contaminants, including flux, and an intermediate layer selectively applied to the surfaces of the chamber housing. The reflow oven may include fabricating the intermediate layer with a foam material, including foaming polymers, e.g., epoxy, polyurethane, polyester, and silicone, or a non-foam material, including non-foaming polymers, e.g., polytetrafluoroethylene and polyimide. A method of treating surfaces of a reflow oven exposed to contaminants, including flux, is further disclosed.

Abstract: A computer implemented system and method is provided for generating a layout of the cell defining a circuit component, the layout providing a layout pattern for a target process technology. The method comprises obtaining an archetype layout providing a valid layout pattern for the cell having regard to design rules of the target process technology, and receiving an input data file providing a process technology independent schematic of the circuit component for which the cell is to be generated. A schematic sizing operation is then performed on the input data file, having regard to both schematic constraints applicable to the target process technology and layout constraints derived from the archetype layout, in order to generate an output data file providing a process technology dependent schematic of the circuit component. A cell generation operation is then performed using the output data file and layout data determined from the archetype layout in order to generate the layout of the cell.

Abstract: A reflow oven includes a chamber housing including surfaces that are in contact with heated air mixed with contaminants, including flux, and a water-soluble layer selectively applied to the surfaces of the chamber housing. Embodiments of the reflow oven include an acrylic-based layer, such as an acrylic paint. In one embodiment, the acrylic paint includes a water-soluble polymer, a polymer emulsion, and water. The water-soluble polymer includes butyl benzyl phthalate. In some embodiments, the acrylic paint includes 1-10% by weight butyl benzyl phthalate, 30-55% by weight acrylic polymer emulsion, and balance water. In a certain embodiment, the acrylic paint includes 1-5% by weight butyl benzyl phthalate, 35-50% by weight acrylic poly emulsion, and balance water. Methods of treating surfaces of the reflow oven are further disclosed.

Abstract: A reflow oven includes a chamber housing including surfaces that are in contact with heated air mixed with contaminants, including flux, and a water-soluble layer selectively applied to the surfaces of the chamber housing. Embodiments of the reflow oven include an acrylic-based layer, such as an acrylic paint. In one embodiment, the acrylic paint includes a water-soluble polymer, a polymer emulsion, and water. The water-soluble polymer includes butyl benzyl phthalate. In some embodiments, the acrylic paint includes 1-10% by weight butyl benzyl phthalate, 30-55% by weight acrylic polymer emulsion, and balance water. In a certain embodiment, the acrylic paint includes 1-5% by weight butyl benzyl phthalate, 35-50% by weight acrylic poly emulsion, and balance water. Methods of treating surfaces of the reflow oven are further disclosed.

Abstract: A reflow oven used to join electronic components to a substrate includes a chamber housing having surfaces that are in contact with heated air mixed with contaminants, including flux, and an intermediate layer selectively applied to the surfaces of the chamber housing. The reflow oven may include fabricating the intermediate layer with a foam material, including foaming polymers, e.g., epoxy, polyurethane, polyester, and silicone, or a non-foam material, including non-foaming polymers, e.g., polytetrafluoroethylene and polyimide. A method of treating surfaces of a reflow oven exposed to contaminants, including flux, is further disclosed.

Abstract: An aerosol spray can is provided. The aerosol spray can includes but is not limited to a housing, an initial amount of a chemical within the housing in both liquid and gaseous states, a valve assembly attached to the housing, an extension tube connected with the valve assembly, and a flotation device connected with the extension tube. The chemical in a liquid state forms a top surface above which there is the chemical in a gaseous state. The extension tube is connected with the valve assembly at a first end and extends into the housing at a second end. The second end of the extension tube forms an opening. The flotation device floats on the chemical in a liquid state.

Abstract: An aerosol spray can is provided. The aerosol spray can includes but is not limited to a housing forming a storage chamber, an initial amount of chemical stored in a compressed liquid state within the storage chamber, a valve assembly attached to the housing, and an extension tube connected with the valve assembly at a first end and extending into the storage chamber at a second end. The initial amount of chemical forms a top surface. The general direction of the top surface is perpendicular to the direction of gravity. The valve assembly including a stem forming a central passage through which the chemical dispenses from the storage chamber. The second end of the extension tube remains a distance away from the top surface of the initial amount of chemical regardless of the position of the aerosol spray can.