Abstract: A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, a wicking heat spreader positioned in the microfluidic volume; and a boiling enhancement surface feature positioned on at least one surface of the wicking heat spreader.

Abstract: A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, a wicking heat spreader positioned in the microfluidic volume; and a boiling enhancement surface feature positioned on at least one surface of the wicking heat spreader.

Abstract: A thermal management device includes a wicking heat spreader and a boiling enhancement surface feature positioned on at least one interior surface of the wicking heat spreader.

Abstract: A thermal management device includes a wicking heat spreader and a boiling enhancement surface feature positioned on at least one interior surface of the wicking heat spreader.

Abstract: A climate-control system may include first and second compressors and a suction manifold. The first compressor includes a first shell, a first compression mechanism, and a first suction inlet through which working fluid is drawn into the first compressor. The second compressor includes a second shell, a second compression mechanism, and a second suction inlet through which working fluid is drawn into the second compressor. The suction manifold includes first and second arms. The first arm provides working fluid to the first suction inlet. The second arm provides working fluid to the second suction inlet. The second arm includes a first suction pipe, a second suction pipe, and a suction valve. The suction valve is movable between a first position in which working fluid is allowed to flow through the first suction pipe and a second position in which working fluid is allowed to flow through the second suction pipe.

Abstract: Backplane employing floating backplane network interconnects for electrical coupling with blade computer systems and related methods. To provide a displacement tolerant interconnection system between the backplane interconnects and respective blade backplane interconnects of blade computer systems to establish electrical connections therebetween, the backplane interconnects are provided as floating backplane interconnections. The floating backplane interconnects are configured to move and be displaced relative to the backplane while still retaining an electrical connection to the backplane. The backplane interconnects each include one or more flex circuits connected to electrical interconnects on the backplane on a first end, and electrical interconnects on a backplane connector on a second end.

Abstract: The description relates to cooling electronic components, such as computing devices. One example includes a rack defining a volume and multiple sealed chassis modules removably fluidly coupled to a two-phase condenser tank via a vapor coupler and a liquid coupler. Individual sealed chassis modules can contain one or more electronic components immersed in two-phase coolant that when heated by operation of the electronic components experiences a phase change from a liquid phase to a gas phase and travels to the two-phase condenser tank via the vapor coupler and is cooled in the two-phase condenser tank until experiencing a phase change back into the liquid phase. Individual sealed chassis modules can be decoupled from the two-phase condenser tank without releasing two-phase coolant and an entirety of the multiple sealed chassis modules and the condenser tank are contained in the volume of the rack.

Abstract: A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, a wicking heat spreader positioned in the microfluidic volume; and a boiling enhancement surface feature positioned on at least one surface of the wicking heat spreader.

Abstract: A thermal management device includes a wicking heat spreader and a boiling enhancement surface feature positioned on at least one interior surface of the wicking heat spreader.

Abstract: In some embodiments, a thermal management system includes an immersion tank defining an immersion chamber, a two-phase working fluid positioned in the immersion chamber, and a pressure trim device in fluid communication with the immersion chamber. The pressure trim device includes at least one of a cold thermal sink and a hot thermal sink. The cold thermal sink is maintained at a suppressed temperature less than a boiling temperature of the two-phase working fluid. The hot thermal sink is maintained at an elevated temperature greater than a boiling temperature of the two-phase working fluid.

Abstract: A heat sink includes a body with an expansion chamber therein. The body is configured to receive heat from a heat source. The expansion chamber is configured to expand a working fluid from an inlet port to an outlet port of the heat sink. An immersion system includes a heat sink and a pressurizing mechanism for pressurizing the working fluid prior to the inlet port.

Abstract: An immersion cooling thermal management system includes a heat duct thermally coupled to a heat-generating electronic component. The heat duct has an inlet at a first longitudinal end of a channel and an outlet at an opposite second longitudinal end of the channel. The heat-generating electronic component is thermally coupled with the channel longitudinally between the inlet and the outlet. The outlet of the channel is higher than the inlet relative to a direction of gravity.

Abstract: Systems with indium application to heat transfer surfaces and related methods are described. A system includes a chassis, arranged inside a housing, having at least one slot for receiving a blade. The blade, arranged in a slot of the chassis, includes a first circuit board having a plurality of components mounted on a substrate. The blade further includes a first heat spreader comprising a metal. The first heat spreader including metal is arranged to transfer heat from the first circuit board to a cooling system via a first interface between a first surface of the first heat spreader and a second surface of the chassis, and where indium is permanently bonded to either the first surface of the first heat spreader, or the second surface of the chassis, or both the first surface of the first heat spreader and the second surface of the chassis.

Abstract: The description relates to cooling electronic components, such as computing devices. One example includes a rack defining a volume and multiple sealed chassis modules removably fluidly coupled to a two-phase condenser tank via a vapor coupler and a liquid coupler. Individual sealed chassis modules can contain one or more electronic components immersed in two-phase coolant that when heated by operation of the electronic components experiences a phase change from a liquid phase to a gas phase and travels to the two-phase condenser tank via the vapor coupler and is cooled in the two-phase condenser tank until experiencing a phase change back into the liquid phase. Individual sealed chassis modules can be decoupled from the two-phase condenser tank without releasing two-phase coolant and an entirety of the multiple sealed chassis modules and the condenser tank are contained in the volume of the rack.

Abstract: A climate-control system may include first and second compressors, first and second suction valves, and a control module. The first and second compressors each include a shell and a compression mechanism. The shells define suction chambers from which the compression mechanisms draw working fluid. The shells include suction inlets through which working fluid is drawn into the suction chambers. The first suction valve may be movable between a fully open position and a partially closed position and may control a flow of working fluid through the first suction inlet. The second suction valve may be movable between a fully open position and a partially closed position and may control a flow of working fluid through the second suction inlet. The control module may control positions of the first and second suction valves to control lubricant levels in the first and second shells.

Abstract: Backplane employing floating backplane network interconnects for electrical coupling with blade computer systems and related methods. To provide a displacement tolerant interconnection system between the backplane interconnects and respective blade backplane interconnects of blade computer systems to establish electrical connections therebetween, the backplane interconnects are provided as floating backplane interconnections. The floating backplane interconnects are configured to move and be displaced relative to the backplane while still retaining an electrical connection to the backplane. The backplane interconnects each include one or more flex circuits connected to electrical interconnects on the backplane on a first end, and electrical interconnects on a backplane connector on a second end.

Abstract: Systems with indium application to heat transfer surfaces and related methods are described. A system includes a chassis, arranged inside a housing, having at least one slot for receiving a blade. The blade, arranged in a slot of the chassis, includes a first circuit board having a plurality of components mounted on a substrate. The blade further includes a first heat spreader comprising a metal. The first heat spreader including metal is arranged to transfer heat from the first circuit board to a cooling system via a first interface between a first surface of the first heat spreader and a second surface of the chassis, and where indium is permanently bonded to either the first surface of the first heat spreader, or the second surface of the chassis, or both the first surface of the first heat spreader and the second surface of the chassis.

Abstract: Disclosed is a cooling assembly for circuit boards. In one embodiment, the assembly includes a circuit board that is thermally and physically coupled to a heat spreader by a thermal interface. In one configuration, the circuit board is formed from a semiconductor material and includes a first board surface on which integrated circuits are mounted and a second board surface opposite the first board surface. The heat spreader is formed from a thermally conductive material and includes a plurality of vanes that are spaced apart from one another. The thermal interface is coupled between at least one area of the second board surface of the circuit board and a contact area of each of the plurality of vanes. Heat generated by the integrated circuits is conducted from at least one integrated circuit to the plurality of vanes of the heat spreader through the circuit board and the thermal interface.

Abstract: A compact and simplified heave compensation system for reducing the effect of waves or wavelike movements on a lifting device. The system can have active and passive heave compensation components. An overload protection to protect lifting equipment can also be implemented. The system enables accurate load and displacement calculations, as well as simplifying the control schemes utilized for lifting devices.

Abstract: Disclosed is a cooling assembly for circuit boards. In one embodiment, the assembly includes a circuit board that is thermally and physically coupled to a heat spreader by a thermal interface. In one configuration, the circuit board is formed from a semiconductor material and includes a first board surface on which integrated circuits are mounted and a second board surface opposite the first board surface. The heat spreader is formed from a thermally conductive material and includes a plurality of vanes that are spaced apart from one another. The thermal interface is coupled between at least one area of the second board surface of the circuit board and a contact area of each of the plurality of vanes. Heat generated by the integrated circuits is conducted from at least one integrated circuit to the plurality of vanes of the heat spreader through the circuit board and the thermal interface.