Abstract: Systems and methods according to one or more embodiments are provided for a scalable planar phased array antenna subarray tile assembly. A scalable phased array antenna subarray tile assembly is implemented as a printed wiring board (PWB) with antenna elements coupled to the PWB. In one example, a PWB includes integrated circuit die attached directly to a first surface of the PWB and couple to antenna elements coupled on a second surface of the PWB. First conductive vias extend through a first subset of PWB layers and couple to the integrated circuit die. Second conductive vias, larger than the first, extend through a second subset of PWB layers and couple to the antenna elements. A conductive trace couples the first and second conductive vias on a PWB layer. The second conductive vias are offset from the first to provide a thermal mechanical stress relief to the integrated circuit die.

Abstract: Systems and methods according to one or more embodiments are provided for a scalable planar phased array antenna subarray tile assembly. A scalable phased array antenna subarray tile assembly is implemented as a printed wiring board (PWB) with antenna elements coupled to the PWB. In one example, a PWB includes integrated circuit die attached directly to a first surface of the PWB and couple to antenna elements coupled on a second surface of the PWB. First conductive vias extend through a first subset of PWB layers and couple to the integrated circuit die. Second conductive vias, larger than the first, extend through a second subset of PWB layers and couple to the antenna elements. A conductive trace couples the first and second conductive vias on a PWB layer. The second conductive vias are offset from the first to provide a thermal mechanical stress relief to the integrated circuit die.

Abstract: A method and apparatus for creating an antenna system. A configuration for a plurality of antenna cells is selected for an antenna in the antenna system. Each antenna cell in the plurality of antenna cells comprises a plurality of antenna elements having a symmetric arrangement. A portion of antenna elements in the plurality of antenna elements for each antenna cell in the plurality of antenna cells on a substrate is selected to transmit electromagnetic waves.

Abstract: A multi-channel circulator or isolator well suited for use in phased array antennas or other RF devices where space and packaging constraints make the implementation of a conventional circular or isolator difficult or impossible. The multi-channel circulator/isolator can be configured as an isolator by the inclusion of one or more load resistors at one of its ports. In various configurations two or more ferrite substrates are provided that each provide a plurality of transmission ports. One or more permanent magnets are used to simultaneously provide the magnetic flux field through both of the substrates. The substrates can be configured such that they are spaced apart by a small distance, or positioned face to face in contact with one another. One or a plurality of magnets can be used depending upon RF requirements. Each substrate forms an independent electromagnetic wave propagation channel that limits the propagation of RF energy between its ports in one direction only.

Abstract: A method and structure for producing an angled RF connection between a first element and a second element using a flexible substrate is provided. The method includes laminating a flexible substrate onto the first element; bending the flexible substrate such that a bonding pad on the flexible substrate is in a similar plane as a bonding pad on the second element; and creating the angled RF connection by wire bonding the bonding pad on the flexible substrate and the bonding pad on the second element. The structure includes a flexible substrate that is laminated onto a first element as an outer layer, flexible substrate having at least one bonding pad, and the flexible substrate able to bend in an angle that places the bonding pad in a same plane as a bonding pad on a second element.

Abstract: A method and structure for producing an angled RF connection between a first element and a second element using a flexible substrate is provided. The method includes laminating a flexible substrate onto the first element; bending the flexible substrate such that a bonding pad on the flexible substrate is in a similar plane as a bonding pad on the second element; and creating the angled RF connection by wire bonding the bonding pad on the flexible substrate and the bonding pad on the second element. The structure includes a flexible substrate that is laminated onto a first element as an outer layer, flexible substrate having at least one bonding pad, and the flexible substrate able to bend in an angle that places the bonding pad in a same plane as a bonding pad on a second element.

Abstract: A multi-channel circulator or isolator well suited for use in phased array antennas or other RF devices where space and packaging constraints make the implementation of a conventional circular or isolator difficult or impossible. The multi-channel circulator/isolator can be configured as an isolator by the inclusion of one or more load resistors at one of its ports. In various configurations two or more ferrite substrates are provided that each provide a plurality of transmission ports. One or more permanent magnets are used to simultaneously provide the magnetic flux field through both of the substrates. The substrates can be configured such that they are spaced apart by a small distance, or positioned face to face in contact with one another. One or a plurality of magnets can be used depending upon RF requirements. Each substrate forms an independent electromagnetic wave propagation channel that limits the propagation of RF energy between its ports in one direction only.

Abstract: A multi-channel circulator or isolator well suited for use in phased array antennas or other RF devices where space and packaging constraints make the implementation of a conventional circular or isolator difficult or impossible. The multi-channel circulator/isolator can be configured as an isolator by the inclusion of one or more load resistors at one of its ports. In various configurations two or more ferrite substrates are provided that each provide a plurality of transmission ports. One or more permanent magnets are used to simultaneously provide the magnetic flux field through both of the substrates. The substrates can be configured such that they are spaced apart by a small distance, or positioned face to face in contact with one another. One or a plurality of magnets can be used depending upon RF requirements. Each substrate forms an independent electromagnetic wave propagation channel that limits the propagation of RF energy between its ports in one direction only.

Abstract: A multi-channel circulator or isolator well suited for use in phased array antennas or other RF devices where space and packaging constraints make the implementation of a conventional circular or isolator difficult or impossible. The multi-channel circulator/isolator can be configured as an isolator by the inclusion of one or more load resistors at one of its ports. In various configurations two or more ferrite substrates are provided that each provide a plurality of transmission ports. One or more permanent magnets are used to simultaneously provide the magnetic flux field through both of the substrates. The substrates can be configured such that they are spaced apart by a small distance, or positioned face to face in contact with one another. One or a plurality of magnets can be used depending upon RF requirements. Each substrate forms an independent electromagnetic wave propagation channel that limits the propagation of RF energy between its ports in one direction only.

Abstract: A porous substrate curtain coated with a single coating of a liquid dielectric that is cured into a well adhering film at least 15 microns thick with a uniformity of less than 5 microns. The substrate is cleaned to remove contaminants, heated to remove moisture, curtain coated with a single coating of a viscous heat curable liquid dielectric such as polyimide, and heated to cure the dielectric by increasing the temperature at most 15.degree. C. per minute to a predetermined cure temperature not exceeding 450.degree. C. The invention is well suited for fabricating a dielectric layer in a high density multichip module.