Patents by Inventor Douglas Romm

Douglas Romm has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Palladium-Spot Leadframes for High Adhesion Semiconductor Devices and Method of Fabrication
    Publication number: 20070243665
    Abstract: A leadframe for use in the assembly of integrated circuit chips comprising a base metal structure having an adherent layer of nickel covering said base metal; an adherent film of palladium on said nickel layer; and an adherent layer of palladium on said palladium film, selectively covering areas of said leadframe suitable for bonding wire attachment and solder attachment.
    Type: Application
    Filed: June 15, 2007
    Publication date: October 18, 2007
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Donald Abbott, Michael Mitchell, Paul Moehle, Douglas Romm
  • Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication
    Publication number: 20060001132
    Abstract: A leadframe for use in the assembly of integrated circuit chips comprising a base metal structure having an adherent layer of nickel covering said base metal; an adherent film of palladium on said nickel layer; and an adherent layer of palladium on said palladium film, selectively covering areas of said leadframe suitable for bonding wire attachment and solder attachment.
    Type: Application
    Filed: August 25, 2005
    Publication date: January 5, 2006
    Inventors: Donald Abbott, Michael Mitchell, Paul Moehle, Douglas Romm