Patents by Inventor Douglas Ryan Jorgesen

Douglas Ryan Jorgesen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging high-frequency microwave circuits using hot via die attach with interposer
    Patent number: 11869858
    Abstract: Microwave packaging uses signal vias and interposers, such as metal lead frame interposers. For example, the microwave circuit die includes signal vias that electrically connect the top side and the bottom side of the die. Microwave signal circuitry on the die have signal paths that are electrically connected to the top side of the signal vias. The microwave signal circuitry typically may have an operating frequency of 300 MHz or faster. The bottom side of the signal vias are electrically connected to corresponding areas on the top side of the interposer. The bottom side of the die may also include a ground plane, with ground vias that electrically connect the top side of the die to the ground plane.
    Type: Grant
    Filed: January 5, 2022
    Date of Patent: January 9, 2024
    Assignee: Marki Microwave, Inc.
    Inventors: Christopher Ferenc Marki, Jeff Luu, Douglas Ryan Jorgesen
  • PACKAGING HIGH-FREQUENCY MICROWAVE CIRCUITS USING HOT VIA DIE ATTACH WITH INTERPOSER
    Publication number: 20230215823
    Abstract: Microwave packaging uses signal vias and interposers, such as metal lead frame interposers. For example, the microwave circuit die includes signal vias that electrically connect the top side and the bottom side of the die. Microwave signal circuitry on the die have signal paths that are electrically connected to the top side of the signal vias. The microwave signal circuitry typically may have an operating frequency of 300 MHz or faster. The bottom side of the signal vias are electrically connected to corresponding areas on the top side of the interposer. The bottom side of the die may also include a ground plane, with ground vias that electrically connect the top side of the die to the ground plane.
    Type: Application
    Filed: January 5, 2022
    Publication date: July 6, 2023
    Inventors: Christopher Ferenc Marki, Jeff Luu, Douglas Ryan Jorgesen