Abstract: A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace.

Abstract: Aspects described herein relate generally to rotary compressors that incorporate a flywheel within to significantly reduce the compressor vibration and drive torque ripples as well as to achieve a higher overall electro-mechanical efficiency and potentially lower combined costs of BLDC rotary compressors and their drive electronics.

Abstract: The present disclosure relates to a new breed of high performance compressors and associated vapor compression systems that can be used in wide ranging refrigeration, cooling and heating applications with significantly increased compressor isentropic efficiency, motor efficiency, reliability and longevity of the motor, the compressor pump and the system as a whole, as well as COP, heating capacity, and SEER of the new vapor compression systems utilizing the new high performance compressors. The design philosophy and modifications to the current configuration of rolling piston rotary compressor to arrive at the high-performance version of the same type will be readily applicable to other types of vapor compression compressors with only minor changes opening the way for adoption of the new design philosophy by the entire compressor industry resulting in serious reduction of carbon footprint for air conditioners, heat pumps and refrigerators worldwide.

Abstract: The present disclosure relates to a low noise, compact rotary compressor configured to damp noise and vibration generated from internal components. The compressor may include a stator holder coupled to the stator and the pump, providing physical separation between the stator and the casing. The compressor may also include a pump holder coupled to the pump and the casing, providing physical separation between the pump and the casing. Additional damping components may be placed at various coupling points within and around the stator holder and/or pump holder. The suction line connection may also be configured to reduce noise and vibration. Aspects of the present disclosure may be applicable for reducing the noise and vibration in a number of fluid displacement devices and BLDC motors.

Abstract: The present disclosure relates to a low noise, compact rotary compressor configured to damp noise and vibration generated from internal components. The compressor may include a stator holder coupled to the stator and the pump, providing physical separation between the stator and the casing. The compressor may also include a pump holder coupled to the pump and the casing, providing physical separation between the pump and the casing. Additional damping components may be placed at various coupling points within and around the stator holder and/or pump holder. The suction line connection may also be configured to reduce noise and vibration. Aspects of the present disclosure may be applicable for reducing the noise and vibration in a number of fluid displacement devices and BLDC motors.

Abstract: Aspects described herein relate generally to rotary compressors that incorporate a flywheel within to significantly reduce the compressor vibration and drive torque ripples as well as to achieve a higher overall electro-mechanical efficiency and potentially lower combined costs of BLDC rotary compressors and their drive electronics.

Abstract: The present disclosure relates to a low noise, compact rotary compressor configured to damp noise and vibration generated from internal components. The compressor may include a stator holder coupled to the stator and the pump, providing physical separation between the stator and the casing. The compressor may also include a pump holder coupled to the pump and the casing, providing physical separation between the pump and the casing. Additional damping components may be placed at various coupling points within and around the stator holder and/or pump holder. The suction line connection may also be configured to reduce noise and vibration. Aspects of the present disclosure may be applicable for reducing the noise and vibration in a number of fluid displacement devices and BLDC motors.

Abstract: Disclosed is a thermoelectric fan for use with radiant heaters, particularly catalytic heaters. The thermoelectric fan of the present invention comprises a housing sub-assembly coupled to a thermal plate sub-assembly, the housing sub-assembly comprising a shrouded circulating air moving member, such as a fan blade, powered solely by the conversion of heat from a separate heater into electricity via an integrated thermoelectric module. Also disclosed is a self-powered fan that can safely perform in hazardous atmospheres while converting radiant heat to circulate air. The thermoelectric fan of the present invention ensures that the air within the space to be heated is more effectively distributed and temperature gradients are minimized. Also disclosed are methods for assembling, installing and safe operation of the thermoelectric fan.

Abstract: A workpiece chuck includes a thermal plate assembly which includes both heating and cooling capability. The heating element can be a resistive heater in a coiled configuration disposed in a plane. The cooling can be performed via a cooling fluid circulated through cooling tubes which are also disposed in a coiled configuration in a plane. The plane of the heating element and the cooling tubes can be the same plane, and that plane can be a center plane of the thermal plate assembly. By locating the heating and cooling in the same plane, uniform heating and cooling are achieved. Also, by locating the heating element and cooling tubes in the center of the thermal plate, distortions such as doming and dishing in the thermal plate are eliminated such that the wafer can be held extremely flat on the chuck. The heating element and cooling tubes are coiled in an interleaved fashion to provide uniform heating and cooling while allowing them to simultaneously occupy the same plane.

Abstract: A system and method for controlling temperature in a workpiece chuck are described. A fluid circulation system circulates a temperature control fluid, such as an engineered HFE fluid, through te workpiece chuck. A fluid recovery system coupled to the fluid circulation system recovers a portion of the temperature control fluid from the fluid circulation system by circulating a gas through the fluid circulation system including fluid tubes and fluid passages in the chuck. The gas, which can be air, carries a portion of residual or excess fluid through the fluid circulation system as it is circulated. The residual fluid is carried back to a reservoir such that it can continue to be used to control temperature of the chuck. Where gas and temperature control fluid vapors are displaced from the reservoir, they are routed through a suction line heat exchanger which condenses the vapor. The gas and condensed fluid are separated in a fluid separator.

Abstract: A workpiece chuck to support a semiconductor wafer during processing includes a thermal plate assembly which includes both heating and cooling capability. The heating element can be a resistive heater in a coiled configuration disposed in a plane. The cooling can be performed via a cooling fluid circulated through cooling tubes which are also disposed in a coiled configuration in a plane. The plane of the heating element and the cooling tubes can be the same plane, and that plane can be a center plane of the thermal plate assembly. The heating element and cooling tubes are coiled in an interleaved fashion to provide uniform heating and cooling while allowing them to simultaneously occupy the same plane. The thermal plate assembly can include a housing made of a cast material such as aluminum. The chuck also provides for interchangeable top surface assemblies used to support the workpiece chuck.

Abstract: A workpiece chuck used, for example, to support a semiconductor wafer during processing, is described. In one aspect, the chuck includes a thermal plate assembly which includes both heating and cooling capability. The heating element can be a resistive heater in a coiled configuration disposed in a plane. The cooling can be performed via a cooling fluid circulated through cooling tubes which are also disposed in a coiled configuration in a plane. The plane of the heating element and the cooling tubes can be the same plane, and that plane can be a center plane of the thermal plate assembly. By locating the heating and cooling in the same plane, uniform heating and cooling are achieved. Also, by locating the heating element and cooling tubes in the center of the thermal plate, distortions such as doming and dishing in the thermal plate are eliminated such that the wafer can be held extremely flat on the chuck.

Abstract: An apparatus and method for controlling temperature in a device under test (DUT) having an integrated circuit chip die includes a temperature sensing device, such as a temperature sensitive diode, integrally formed in the chip die. A sensing circuit senses a signal from the diode indicative of temperature of the chip die. The sensing circuit can be part of a testing circuit in a system being used to test the DUT. The sensing circuit sends a control signal to a temperature control system used to control the temperature of a DUT temperature control medium. The temperature control medium can be, for example, a stream of temperature-controlled air directed onto the package of the DUT. In response to the control signal, the temperature control system controls the temperature of the air at a desired temperature to control the temperature of the DUT.

Abstract: An apparatus and method for controlling temperature in a wafer on a wafer chuck includes a temperature sensing device, such as a temperature sensitive diode, integrally formed in the wafer. A sensing circuit senses a signal from the diode indicative of temperature of the wafer. The sensing circuit can be part of a testing circuit in a wafer prober being used to test integrated circuits on the wafer. The sensing circuit sends a control signal to a temperature control system used to control the temperature of the chuck. In response to the control signal, the temperature control system controls the temperature of the chuck at a desired temperature to control the temperature of the wafer. The wafer can include multiple integrated circuit die, and each circuit can include its own temperature sensing diode. As a result, extremely accurate and individualized temperature testing can be performed on each integrated circuit on the wafer.

Abstract: A workpiece chuck used, for example, to support a semiconductor wafer during processing, is described. In one aspect, the chuck includes a thermal plate assembly which includes both heating and cooling capability. The heating element can be a resistive heater in a coiled configuration disposed in a plane. The cooling can be performed via a cooling fluid circulated through cooling tubes which are also disposed in a coiled configuration in a plane. The plane of the heating element and the cooling tubes can be the same plane, and that plane can be a center plane of the thermal plate assembly. By locating the heating and cooling in the same plane, uniform heating and cooling are achieved. Also, by locating the heating element and cooling tubes in the center of the thermal plate, distortions such as doming and dishing in the thermal plate are eliminated such that the wafer can be held extremely flat on the chuck.

Abstract: An apparatus and method for controlling temperature in a device under test (DUT) having an integrated circuit chip die includes a temperature sensing device, such as a temperature sensitive diode, integrally formed in the chip die. A sensing circuit senses a signal from the diode indicative of temperature of the chip die. The sensing circuit can be part of a testing circuit in a system being used to test the DUT. The sensing circuit sends a control signal to a temperature control system used to control the temperature of a DUT temperature control medium. The temperature control medium can be, for example, a stream of temperature-controlled air directed onto the package of the DUT. In response to the control signal, the temperature control system controls the temperature of the air at a desired temperature to control the temperature of the DUT.

Abstract: A system and method for controlling temperature in a workpiece chuck are described. A fluid circulation system circulates a temperature control fluid, such as an engineered HFE fluid, through te workpiece chuck. A fluid recovery system coupled to the fluid circulation system recovers a portion of the temperature control fluid from the fluid circulation system by circulating a gas through the fluid circulation system including fluid tubes and fluid passages in the chuck. The gas, which can be air, carries a portion of residual or excess fluid through the fluid circulation system as it is circulated. The residual fluid is carried back to a reservoir such that it can continue to be used to control temperature of the chuck. Where gas and temperature control fluid vapors are displaced from the reservoir, they are routed through a suction line heat exchanger which condenses the vapor. The gas and condensed fluid are separated in a fluid separator.