Patents by Inventor Douglas S. Penrod

Douglas S. Penrod has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230374787
    Abstract: A shingle comprises an overlay, an underlay, and a height increasing material disposed between the overlay and the underlay. The height increasing material includes a first adhesive adhered to the overlay, height increasing granules adhered to the first adhesive, and a second adhesive adhered to the height increasing granules and the underlay. The height increasing material can extend along front ends of tab portions of the overlay, along front cutout edges that extend between tab portions of the overlay, or both.
    Type: Application
    Filed: August 4, 2023
    Publication date: November 23, 2023
    Inventors: Lawrence J. Grubka, Douglas S. Penrod, William E. Smith, John A. Thies, Jacob Paul Honsvick
  • Patent number: 11761210
    Abstract: A shingle comprises an overlay, an underlay, and a height increasing material disposed between the overlay and the underlay. The height increasing material includes a first adhesive adhered to the overlay, height increasing granules adhered to the first adhesive, and a second adhesive adhered to the height increasing granules and the underlay. The height increasing material can extend along front ends of tab portions of the overlay, along front cutout edges that extend between tab portions of the overlay, or both.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: September 19, 2023
    Assignee: Owens Corning Intellectual Capital, LLC
    Inventors: Lawrence J. Grubka, Douglas S. Penrod, William E. Smith, John A. Thies, Jacob Paul Honsvick
  • Publication number: 20210285217
    Abstract: A shingle comprises an overlay, an underlay, and a height increasing material disposed between the overlay and the underlay. The height increasing material includes a first adhesive adhered to the overlay, height increasing granules adhered to the first adhesive, and a second adhesive adhered to the height increasing granules and the underlay. The height increasing material can extend along front ends of tab portions of the overlay, along front cutout edges that extend between tab portions of the overlay, or both.
    Type: Application
    Filed: May 27, 2021
    Publication date: September 16, 2021
    Inventors: Lawrence J. Grubka, Douglas S. Penrod, William E. Smith, John A. Thies, Jacob Paul Honsvick
  • Patent number: 11021876
    Abstract: A shingle comprises an overlay, an underlay, and a height increasing material disposed between the overlay and the underlay. The height increasing material includes a first adhesive adhered to the overlay, height increasing granules adhered to the first adhesive, and a second adhesive adhered to the height increasing granules and the underlay. The height increasing material can extend along front ends of tab portions of the overlay, along front cutout edges that extend between tab portions of the overlay, or both.
    Type: Grant
    Filed: December 4, 2018
    Date of Patent: June 1, 2021
    Assignee: Owens Corning Intellectual Capital, LLC
    Inventors: Lawrence J. Grubka, Douglas S. Penrod, William E. Smith, John A. Thies, Jacob Paul Honsvick
  • Publication number: 20190177978
    Abstract: A shingle comprises an overlay, an underlay, and a height increasing material disposed between the overlay and the underlay. The height increasing material includes a first adhesive adhered to the overlay, height increasing granules adhered to the first adhesive, and a second adhesive adhered to the height increasing granules and the underlay. The height increasing material can extend along front ends of tab portions of the overlay, along front cutout edges that extend between tab portions of the overlay, or both.
    Type: Application
    Filed: December 4, 2018
    Publication date: June 13, 2019
    Inventors: Lawrence J. Grubka, Douglas S. Penrod, William E. Smith, John A. Thies, Jacob Paul Honsvick