Abstract: A configurable switching device includes a switch card coupled to interface with a backplane of a computer chassis, a plurality of PCI-Express switching elements coupled to the switch card, and a configuration means coupled to the switch card, where the configuration means is operable to configure and reconfigure the plurality of PCI-Express switching elements to operate in a plurality of directional fabric domains, and where each of the plurality of PCI-Express switching elements can operate in only one of the plurality of directional fabric domains at a time.

Abstract: In a computer network (100), a method transporting a PCI Express packet (235) from an initiator PCI Express node (202) over an IP packet network (210) to a receiver PCI Express node (204), can include the initiator PCI Express node creating the PCI Express packet and reading a global PCI Express destination address (352) of the PCI Express packet. The initiator PCI Express node can map the global PCI Express destination address to a receiver PCI Express node IP address (242). The PCI Express packet can be encapsulated in an IP packet (236). The IP packet with the encapsulated PCI Express packet can be communicated over an IP packet network (210) to receiver PCI Express node.

Abstract: A method of transporting an IP packet (136) from a receiving RapidIO node (102) over a RapidIO network (112) to a destination RapidIO node (104) includes the RapidIO domain receiving the IP packet and reading a destination IP address (273) of the IP packet, where the destination IP address corresponds to the destination RapidIO node. The receiving RapidIO node creates at least one RapidIO packet (135) and maps the destination IP address of the IP packet to a destination node ID (283) of the at least one RapidIO packet The destination node ID is placed into a RapidIO header (280) of the at least one RapidIO packet and at least a portion of the IP packet is encapsulated in the at least one RapidIO packet. The at least one RapidIO packet is communicated to the destination RapidIO node over the RapidIO network.

Abstract: A method of transporting a RapidIO packet (135) from an initiator RapidIO domain (102) over an IP packet network (110) to a receiver RapidIO domain (104) can include the initiator RapidIO domain creating the RapidIO packet and reading a destination domain ID (483) of the RapidIO packet, where the destination domain ID corresponds to the receiver RapidIO domain. The destination domain ID is mapped to a receiver RapidIO domain IP address (473). The RapidIO packet is encapsulated in an IP packet (436) and the IP packet is communicated to the receiver RapidIO domain over the IP packet network.

Abstract: A method of communicating a VMEbus transfer (235) from an initiator VMEbus domain (202) over an IP packet network (210) to a responder VMEbus domain (204) can include the initiator VMEbus domain creating the VMEbus transfer and reading a VMEbus destination address (452) of the VMEbus transfer. The VMEbus destination address can be mapped to a responder VMEbus domain IP address and the VMEbus transfer encapsulated in an IP packet (236). The IP packet can be communicated to the responder VMEbus domain over the IP packet network.

Abstract: A method of transporting a PCI Express packet (135) from an initiator PCI Express domain (102) over a VMEbus network (110) to a receiver PCI Express domain (104), can include the initiator PCI Express domain creating the PCI Express packet, while a PCI Express-to-VMEbus encapsulation module (103) reads a first PCI Express destination address (250) of the PCI Express packet. The first PCI Express destination address is mapped to a receiver PCI Express domain VMEbus address (242). The PCI Express packet is encapsulated in a data field (282) of a VMEbus write transaction (236) by the PCI Express-to-VMEbus encapsulation module. The VMEbus write transaction is communicated to the receiver PCI Express domain over the VMEbus network.

Abstract: A multi-service platform system (100, 200, 300, 400) includes a computer chassis (101, 201, 301, 401) having a plurality of 3U slots (205), a backplane (104) integrated in the computer chassis, a switched fabric (106) on the backplane. At least one of a VMEbus network and a PCI network are coincident with the switched fabric on the backplane. A payload module (102) having a 3U form factor is coupled to interface with one of the plurality of 3U slots, where the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network. At least one multi-gigabit connector (118) is coupled to a rear edge (119) of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector.

Abstract: A multi-service platform system (100, 200, 300) includes a computer chassis (101, 201, 301) having a plurality of 9U slots (207), a backplane (104) integrated in the computer chassis, a switched fabric (106) on the backplane. At least one of a VMEbus network and a PCI network are coincident with the switched fabric on the backplane. A payload module (102) having a 9U form factor is coupled to interface with one of the plurality of 9U slots, where the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network. At least one multi-gigabit connector (118) is coupled to a rear edge (119) of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector.

Abstract: A payload module (202) includes a payload subunit (212) coupled to the payload module, where the payload module has one of a 3U form factor, a 6U form factor and a 9U form factor. At least one multi-gigabit connector (218) is coupled to a rear edge (219) of the payload module and to the payload subunit, where the at least one multi-gigabit connector is coupled to communicatively interface the payload subunit to a backplane (204), where the backplane includes a switched fabric (206) coincident with at least one of a VMEbus network and a PCI network, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload subunit through the at least one multi-gigabit connector.

Abstract: A multi-service platform system, includes a backplane (104), a switched fabric (106) on the backplane, and at least one of a VMEbus network and a PCI network coincident with the switched fabric on the backplane. A payload module (102) has one of a 3U form factor, a 6U form factor and a 9U form factor, where the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network. At least one multi-gigabit connector (118) is coupled to a rear edge (119) of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector.

Abstract: A multi-service platform system, includes a backplane (104), a switched fabric (106) on the backplane, and at least one of a VMEbus network and a PCI network coincident with the switched fabric on the backplane. A payload module (102) has one of a 3U form factor, a 6U form factor and a 9U form factor, where the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network. At least one multi-gigabit connector (118) is coupled to a rear edge (119) of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector. A switched fabric link coupling payload module and a rear transition module (175) operates using a switched fabric protocol.

Abstract: A switch module includes a board (114) having one of a 3U form factor and a 9U form factor, and a central switching resource (116) coupled to the board, where the central switching resource is coupled to operate a switched fabric (106) on a backplane (104), where the switched fabric operates coincident with at least one of a VMEbus network and a PCI network on the backplane.

Abstract: A multi-service platform system, includes a backplane (104), a switched fabric (106) on the backplane, and at least one of a VMEbus network and a PCI network coincident with the switched fabric on the backplane. A payload module (102) has one of a 3U form factor, a 6U form factor and a 9U form factor, where the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network. At least one multi-gigabit connector (118) is coupled to a rear edge (119) of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector. A storage module (112, 113) is coupled to the payload module, where the storage module is coupled to communicate with the switched fabric.

Abstract: A switched fabric mezzanine storage module (560) includes a storage module (562) and a switched fabric connector (563) coupled to the storage module. The storage module is coupled to directly communicate with a switched fabric (506), where the switched fabric storage mezzanine module is coupled to a payload module (502) having one of a 3U form factor, a 6U form factor and a 9U form factor. The payload module can include at least one multi-gigabit connector (518) coupled to a rear edge (519) of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface with a backplane (504). The backplane includes the switched fabric coincident with at least one of a VMEbus network and a PCI network, where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled to the storage module through the at least one multi-gigabit connector.

Abstract: A multi-service platform system (100) includes a computer chassis (101), a backplane (104) integrated in the computer chassis, a switched fabric (106) on the backplane. At least one of a VMEbus network and a PCI network are coincident with the switched fabric on the backplane. A payload module (102) has one of a 3 U form factor, a 6 U form factor and a 9 U form factor, where the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network. At least one multi-gigabit connector (118) is coupled to a rear edge (119) of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector.

Abstract: A multi-service platform system, includes a backplane (104), a switched fabric (106) on the backplane, and at least one of a VMEbus network and a PCI network coincident with the switched fabric on the backplane. A payload module (102) has one of a 6U form factor and a 9U form factor, where the payload module is communicatively coupled with the backplane using the switched fabric and at least one of the VMEbus network and the PCI network. At least one multi-gigabit connector (118) is coupled to a rear edge (119) of the payload module, where the at least one multi-gigabit connector is coupled to communicatively interface the payload module to the backplane, and where the switched fabric and at least one of the VMEbus network and the PCI network are communicatively coupled with the payload module through the at least one multi-gigabit connector. At least one of a payload subunit (112) and an I/O element (105) are coupled to the payload module.

Abstract: A computing blade (102) having a USB electrical interface (106), includes a USB interface module (104) having a corresponding USB electrical interface (108), where the USB interface module is communicatively coupled to the computing blade through the USB electrical interface and the corresponding USB electrical interface, and wherein the USB interface module is non-embedded on the computing blade. A computing resource (110) is coupled to the USB interface module, where the computing resource communicates with the computing blade using a USB protocol (118). A mechanical retention device (112) secures the USB interface module to the computing blade, where the mechanical retention device permits user removal of the USB interface module from the computing blade.

Abstract: A stacked 3U payload module unit (207) includes a base module (220), where the base module has a 3U form factor (229), and where the base module is coupled to directly communicate with a switched fabric (106) on a backplane (104) of a computer chassis (112), where the backplane comprises the switched fabric and a VMEbus network (108) operating concurrently. Stacked 3U payload module unit (207) can also include a stacking module (222) coupled to the base module, wherein the stacking module has the 3U form factor, wherein the stacking module is communicatively coupled to the base module through a stacking switched fabric connector (209), and wherein the stacking module is communicatively coupled to the switched fabric via the base module and the stacking switched fabric connector.

Abstract: A hot-swappable power module (414) includes a power supply (540) and a switched fabric connector (527) coupled to communicatively interface with a switched fabric (406), where the switched fabric operates concurrently with a VMEbus network (408) on a backplane (404) of a computer chassis (412), where the hot-swappable power module is coupled to interface with and supply power to the computer chassis, where the hot-swappable power module has a 3U form factor (529), and where at least one of coupling and decoupling the hot swappable power module to the computer chassis fails to disrupt power to the computer chassis. Hot-swappable power module (414) can also include a switched fabric data unit (542) coupled to the power supply and the switched fabric connector, wherein the switched fabric data unit is coupled to communicate with the switched fabric.

Abstract: An optimized network (300), includes providing a switch card topology (350) having a plurality of switching elements (305), where the plurality of switching elements are arranged to form a switch configuration (303). N number of payload interfaces (307) are coupled to the switch configuration, where each of the N number of payload interfaces is coupled to interface with one of a plurality of payload slots (308). A set of N payload module configurations (402, 502) is characterized by a sequential addition (320) of a payload module (304) into each of the plurality of payload slots, where the sequential addition of the payload module couples the payload module to the network. N number of payload interfaces are coupled to the switch configuration such that a latency function (616) is minimized for the switch configuration and the set of N payload module configurations.