Patents by Inventor Douglas Seiji Okamoto

Douglas Seiji Okamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10381705
    Abstract: A power combiner/power divider has a disk shaped housing cavity and a housing of electrically conductive material, such as metal. A junction pin is positioned centrally in the power combiner/divider. Additional ports are positioned radially along the periphery of the disk shaped portion. Tapered waveguides may extend from the radially positioned ports to the centrally positioned junction pin. A hollow radial cavity provided in the cavity holds a dielectric insert that may have tapering extensions radiating from a central ring. The ring surrounds the centrally positioned port.
    Type: Grant
    Filed: June 16, 2017
    Date of Patent: August 13, 2019
    Assignee: Mercury Systems, Inc.
    Inventor: Douglas Seiji Okamoto
  • Publication number: 20180366806
    Abstract: A power combiner/power divider has a disk shaped housing cavity and a housing of electrically conductive material, such as metal. A junction pin is positioned centrally in the power combiner/divider. Additional ports are positioned radially along the periphery of the disk shaped portion. Tapered waveguides may extend from the radially positioned ports to the centrally positioned junction pin. A hollow radial cavity provided in the cavity holds a dielectric insert that may have tapering extensions radiating from a central ring. The ring surrounds the centrally positioned port.
    Type: Application
    Filed: June 16, 2017
    Publication date: December 20, 2018
    Inventor: Douglas Seiji OKAMOTO
  • Patent number: 8520390
    Abstract: An electro-magnetic device assembly constituted of an electro-magnetic device; a chassis arranged to sink heat; at least one thermally conductive material in thermal communication with the electro-magnetic device and with the chassis; and at least one mechanically isolating material in contact with the thermally conductive material and with the chassis, the at least one mechanically isolating material arranged to dampen the transmission of vibrations experienced by the chassis, in the direction of the magnetic field of the electro-magnetic device, to the electro-magnetic device.
    Type: Grant
    Filed: March 29, 2011
    Date of Patent: August 27, 2013
    Assignee: Microsemi Corporation
    Inventors: Douglas Seiji Okamoto, Timothy J Dasilva, Louis Ray Pledger, Jr.
  • Publication number: 20110242767
    Abstract: An electro-magnetic device assembly constituted of an electro-magnetic device; a chassis arranged to sink heat; at least one thermally conductive material in thermal communication with the electro-magnetic device and with the chassis; and at least one mechanically isolating material in contact with the thermally conductive material and with the chassis, the at least one mechanically isolating material arranged to dampen the transmission of vibrations experienced by the chassis, in the direction of the magnetic field of the electro-magnetic device, to the electro-magnetic device.
    Type: Application
    Filed: March 29, 2011
    Publication date: October 6, 2011
    Applicant: MICROSEMI CORPORATION
    Inventors: Douglas Seiji OKAMOTO, Timothy J DASILVA, Louis Ray PLEDGER, JR.
  • Patent number: 7145414
    Abstract: A circuit structure may include first and second transmission lines, each with a center conductor extending along or between one or more spaced-apart conducting surfaces. A conducting surface, such as a ground, reference, or signal-return plane, of the first transmission line may have an orientation that is transverse to the orientation of a conducting surface of the second transmission line. Each of the conducting surfaces of the first transmission line may contact one or more of the conducting surfaces of the second transmission line. In some examples, one or both of the transmission lines are slablines, and in some examples, the contacting edges or edges adjacent the contacting edges of the respective conductive surfaces are curved.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: December 5, 2006
    Assignee: Endwave Corporation
    Inventors: Douglas Seiji Okamoto, Anthony C. Sweeney, Thomas M. Gaudette