Patents by Inventor Douglas Stewart Malchow
Douglas Stewart Malchow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11923470Abstract: A method includes forming an assembly of layers including an InP cap layer on an InGaAs absorption region layer, wherein the InGaAs layer is on an n-InP layer, and wherein an underlying substrate layer underlies the n-InP layer. The method includes removing a portion of the InP cap and n-InP layer by dry etching.Type: GrantFiled: October 24, 2022Date of Patent: March 5, 2024Assignee: Sensors Unlimited, Inc.Inventors: Wei Zhang, Douglas Stewart Malchow, Michael J. Evans, Paul L. Bereznycky, Sean T. Houlihan
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Publication number: 20230050990Abstract: A method includes forming an assembly of layers including an InP cap layer on an InGaAs absorption region layer, wherein the InGaAs layer is on an n-InP layer, and wherein an underlying substrate layer underlies the n-InP layer. The method includes removing a portion of the InP cap and n-InP layer by dry etching.Type: ApplicationFiled: October 24, 2022Publication date: February 16, 2023Applicant: Sensors Unlimited, Inc.Inventors: Wei Zhang, Douglas Stewart Malchow, Michael J. Evans, Paul L. Bereznycky, Sean T. Houlihan
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Patent number: 11495631Abstract: A system includes a pixel including a diffusion layer in contact with an absorption layer. The diffusion layer and absorption layer are in contact with one another along an interface that is inside of a mesa. A trench is defined in the absorption layer surrounding the mesa. An overflow contact is seated in the trench.Type: GrantFiled: February 7, 2020Date of Patent: November 8, 2022Assignee: Sensors Unlimited, Inc.Inventors: Wei Huang, Douglas Stewart Malchow, Michael J. Evans, John Liobe, Wei Zhang
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Publication number: 20220079447Abstract: A method of medical imaging is provided. The method includes receiving pulsed light emissions from fluoroscopic material in a target field of a patient, wherein the target field was treated with fluoroscopic material that emitted the pulsed light emissions in response to a pulsed laser signal. The pulsed laser signal has a wavelength that was selected to excite the fluoroscopic material. The method further includes capturing a passive image of the target field and asynchronously detecting pulses of the pulsed light emissions. The method further includes determining pulse-source coordinates in the image, wherein the pulse-source coordinates correspond to a location of the fluoroscopic material that emitted the pulsed light emissions.Type: ApplicationFiled: September 10, 2021Publication date: March 17, 2022Applicant: Sensors Unlimited, Inc.Inventors: Douglas Stewart Malchow, John Liobe, Thuc-Uyen Nguyen, Brendan Mc Granaghan Murphy
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Patent number: 11251219Abstract: A system includes a pixel having a diffusion layer within a cap layer. The diffusion layer defines a front side and an illumination side opposite the front side with an absorption layer operatively connected to the illumination side as well as the diffusion and cap layers. A set of alternating oxide and nitride layers are deposited on the front side of the cap and diffusion layers.Type: GrantFiled: March 10, 2020Date of Patent: February 15, 2022Assignee: Sensors Unlimited, Inc.Inventors: Wei Zhang, Douglas Stewart Malchow, John Liobe, Michael J. Evans, Wei Huang
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Patent number: 11251210Abstract: A system includes a pixel including a diffusion layer in contact with an absorption layer. A transparent conductive oxide (TCO) is electrically connected to the diffusion layer. An overflow contact is in electrical communication with the TCO. The overflow contact can be spaced apart laterally from the diffusion layer. The pixel can be one of a plurality of similar pixels arranged in a grid pattern, wherein each pixel has a respective overflow contact, forming an overflow contact grid offset from the grid pattern.Type: GrantFiled: February 7, 2020Date of Patent: February 15, 2022Assignee: Sensors Unlimited, Inc.Inventors: Wei Huang, Douglas Stewart Malchow, Michael J. Evans, John Liobe, Wei Zhang
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Publication number: 20210288100Abstract: A system includes a pixel having a diffusion layer within a cap layer. The diffusion layer defines a front side and an illumination side opposite the front side with an absorption layer operatively connected to the illumination side as well as the diffusion and cap layers. A set of alternating oxide and nitride layers are deposited on the front side of the cap and diffusion layers.Type: ApplicationFiled: March 10, 2020Publication date: September 16, 2021Applicant: Sensors Unlimited, Inc.Inventors: Wei Zhang, Douglas Stewart Malchow, John Liobe, Michael J. Evans, Wei Huang
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Publication number: 20210249455Abstract: A system includes a pixel including a diffusion layer in contact with an absorption layer. A transparent conductive oxide (TCO) is electrically connected to the diffusion layer. An overflow contact is in electrical communication with the TCO. The overflow contact can be spaced apart laterally from the diffusion layer. The pixel can be one of a plurality of similar pixels arranged in a grid pattern, wherein each pixel has a respective overflow contact, forming an overflow contact grid offset from the grid pattern.Type: ApplicationFiled: February 7, 2020Publication date: August 12, 2021Applicant: Sensors Unlimited, Inc.Inventors: Wei Huang, Douglas Stewart Malchow, Michael J. Evans, John Liobe, Wei Zhang
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Publication number: 20210249462Abstract: A system includes a pixel including a diffusion layer in contact with an absorption layer. The diffusion layer and absorption layer are in contact with one another along an interface that is inside of a mesa. A trench is defined in the absorption layer surrounding the mesa. An overflow contact is seated in the trench.Type: ApplicationFiled: February 7, 2020Publication date: August 12, 2021Applicant: Sensors Unlimited, Inc.Inventors: Wei Huang, Douglas Stewart Malchow, Michael J. Evans, John Liobe, Wei Zhang
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Publication number: 20210104638Abstract: A method includes forming an assembly of layers including an InP cap layer on an InGaAs absorption region layer, wherein the InGaAs layer is on an n-InP layer, and wherein an underlying substrate layer underlies the n-InP layer. The method includes removing a portion of the InP cap and n-InP layer by dry etching.Type: ApplicationFiled: October 4, 2019Publication date: April 8, 2021Applicant: Sensors Unlimited, Inc.Inventors: Wei Zhang, Douglas Stewart Malchow, Michael J. Evans, Paul L. Bereznycky, Sean T. Houlihan
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Patent number: 10957733Abstract: A method of assembling a photodetector assembly includes depositing bumps on a read out integrated circuit (ROIC) without depositing bumps on a photodiode array (PDA). The method includes assembling the PDA and ROIC together wherein each bump electrically interconnects the ROIC with a respective contact of the PDA. A photodetector assembly includes a PDA. A ROIC is assembled to the PDA, wherein the ROIC is electrically interconnected with the PDA through a plurality of electrically conductive bumps. Each bump is confined within a respective pocket between the ROIC and a respective contact of the PDA. The disclosed methods can enable focal plane array manufacturers to achieve low-cost production of ultra-fine pitch, large format imaging arrays.Type: GrantFiled: June 16, 2020Date of Patent: March 23, 2021Assignee: Sensors Unlimited, Inc.Inventors: Wei Zhang, Douglas Stewart Malchow, Michael J. Evans, Wei Huang, Paul L. Bereznycky, Namwoong Paik
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Patent number: 10875987Abstract: A method of determining the composition of a polymeric body includes applying electromagnetic radiation to the polymeric body, modulating the electromagnetic radiation using a tagant disposed within a polymer composition forming the polymeric body, and receiving the modulated electromagnetic radiation from the tagant at an infrared detector. The electromagnetic radiation received from the tagant has a signature corresponding to the polymer composition forming the polymeric body. A method of making a polymeric body and system for determining composition of a polymeric body are also described.Type: GrantFiled: May 1, 2019Date of Patent: December 29, 2020Assignee: Sensors Unlimited, Inc.Inventor: Douglas Stewart Malchow
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Publication number: 20200312900Abstract: A method of assembling a photodetector assembly includes depositing bumps on a read out integrated circuit (ROIC) without depositing bumps on a photodiode array (PDA). The method includes assembling the PDA and ROIC together wherein each bump electrically interconnects the ROIC with a respective contact of the PDA. A photodetector assembly includes a PDA. A ROIC is assembled to the PDA, wherein the ROIC is electrically interconnected with the PDA through a plurality of electrically conductive bumps. Each bump is confined within a respective pocket between the ROIC and a respective contact of the PDA. The disclosed methods can enable focal plane array manufacturers to achieve low-cost production of ultra-fine pitch, large format imaging arrays.Type: ApplicationFiled: June 16, 2020Publication date: October 1, 2020Applicant: Sensors Unlimited, Inc.Inventors: Wei Zhang, Douglas Stewart Malchow, Michael J. Evans, Wei Huang, Paul L. Bereznycky, Namwoong Paik
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Patent number: 10727267Abstract: A method of assembling a photodetector assembly includes depositing bumps on a read out integrated circuit (ROIC) without depositing bumps on a photodiode array (PDA). The method includes assembling the PDA and ROIC together wherein each bump electrically interconnects the ROIC with a respective contact of the PDA. A photodetector assembly includes a PDA. A ROIC is assembled to the PDA, wherein the ROIC is electrically interconnected with the PDA through a plurality of electrically conductive bumps. Each bump is confined within a respective pocket between the ROIC and a respective contact of the PDA. The disclosed methods can enable focal plane array manufacturers to achieve low-cost production of ultra-fine pitch, large format imaging arrays.Type: GrantFiled: September 12, 2018Date of Patent: July 28, 2020Assignee: Sensors Unlimited, Inc.Inventors: Wei Zhang, Douglas Stewart Malchow, Michael J. Evans, Wei Huang, Paul L. Bereznycky, Namwoong Paik
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Publication number: 20200083272Abstract: A method of assembling a photodetector assembly includes depositing bumps on a read out integrated circuit (ROIC) without depositing bumps on a photodiode array (PDA). The method includes assembling the PDA and ROIC together wherein each bump electrically interconnects the ROIC with a respective contact of the PDA. A photodetector assembly includes a PDA. A ROIC is assembled to the PDA, wherein the ROIC is electrically interconnected with the PDA through a plurality of electrically conductive bumps. Each bump is confined within a respective pocket between the ROIC and a respective contact of the PDA. The disclosed methods can enable focal plane array manufacturers to achieve low-cost production of ultra-fine pitch, large format imaging arrays.Type: ApplicationFiled: September 12, 2018Publication date: March 12, 2020Inventors: Wei Zhang, Douglas Stewart Malchow, Michael J. Evans, Wei Huang, Paul L. Bereznycky, Namwoong Paik
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Publication number: 20200052012Abstract: A method of forming an array of photodiodes includes forming a cap layer on a surface of an absorption layer. The method includes forming a plurality of spaced apart pixel diffusion areas in the cap layer. The method includes forming a mesa trench with opposed sidewalls through the cap layer, wherein the mesa trench surrounds each of the pixel diffusion areas separating the pixel diffusion areas from one another. The method includes forming a sidewall passivation layer over the sidewalls of the mesa trench and removing a portion of the sidewall passivation layer to expose a respective contact electrically connected to each of the pixel diffusion areas, but leaving the sidewalls of the mesa trench covered with the sidewall passivation layer wherein the contact is open and uncovered for electrical connection.Type: ApplicationFiled: August 7, 2018Publication date: February 13, 2020Inventors: Wei Zhang, Michael J. Evans, Douglas Stewart Malchow, Paul L. Bereznycky, Namwoong Paik
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Publication number: 20190256685Abstract: A method of determining the composition of a polymeric body includes applying electromagnetic radiation to the polymeric body, modulating the electromagnetic radiation using a tagant disposed within a polymer composition forming the polymeric body, and receiving the modulated electromagnetic radiation from the tagant at an infrared detector. The electromagnetic radiation received from the tagant has a signature corresponding to the polymer composition forming the polymeric body. A method of making a polymeric body and system for determining composition of a polymeric body are also described.Type: ApplicationFiled: May 1, 2019Publication date: August 22, 2019Inventor: Douglas Stewart Malchow
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Patent number: 9485439Abstract: A camera comprises an image plane for capturing shortwave infrared wavelengths. The image plane captures only a portion of a shortwave infrared wavelength band, and excludes other wavelengths. A method of designing a camera is also disclosed.Type: GrantFiled: February 4, 2014Date of Patent: November 1, 2016Assignee: Sensors Unlimited, Inc.Inventors: Douglas Stewart Malchow, Peter Dixon, Robert Rozploch
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Publication number: 20150156426Abstract: A camera comprises an image plane for capturing shortwave infrared wavelengths. The image plane captures only a portion of a shortwave infrared wavelength band, and excludes other wavelengths. A method of designing a camera is also disclosed.Type: ApplicationFiled: February 4, 2014Publication date: June 4, 2015Applicant: Sensors Unlimited, Inc.Inventors: Douglas Stewart Malchow, Peter Dixon, Robert Rozploch