Abstract: An organic light emitting diode (OLED) display device including a base substrate having a display area and a non-display area; OLEDs formed in corresponding sub-pixel regions defined by a bank insulating film in the display area of the base substrate; a pad part formed in the non-display area of the base substrate and configured to apply a driving signal to the OLEDs; a plurality of passivation films formed in the display area to cover the OLEDs, the plurality of passivation films including a first inorganic film, an organic film, and a second inorganic film, the plurality of passivation films being sequentially stacked. A region of an edge of the organic film that corresponds to a wire through which the driving signal is applied to the OLEDs from the pad part includes at least one groove formed at an inside area of the organic film.

Abstract: An organic light emitting diode (OLED) display device including a base substrate having a display area and a non-display area; OLEDs formed in corresponding sub-pixel regions defined by a bank insulating film in the display area of the base substrate; a pad part formed in the non-display area of the base substrate and configured to apply a driving signal to the OLEDs; a plurality of passivation films formed in the display area to cover the OLEDs, the plurality of passivation films including a first inorganic film, an organic film, and a second inorganic film, the plurality of passivation films being sequentially stacked. A region of an edge of the organic film that corresponds to a wire through which the driving signal is applied to the OLEDs from the pad part includes at least one groove formed at an inside area of the organic film.

Abstract: An organic light emitting display (OLED) includes a substrate, first and second driving units positioned on the substrate, a first light emitting diode (LED) connected with the first driving unit and including a first organic light emitting layer and a second emitting diode electrically connected with the second driving unit and including a second organic light emitting layer. The second emitting diode is positioned on the first emitting diode.

Abstract: An organic electroluminescent device, adapted to enhance device reliability while allowing simplification of a manufacturing process, and a method for manufacturing the same are disclosed. The organic electroluminescent (EL) device, comprising a substrate, TFTs located in respective unit pixel regions on the substrate, a first insulation layer to insulate the TFTs, first electrodes formed on the first insulation layer while contacting the TFTs, respectively, a partition wall positioned between the unit pixel regions on the first insulation layer, a subsidiary electrode formed on the partition wall, an organic light emitting layer positioned on the first electrodes, an insulation part to insulate each first electrode from an associated subsidiary electrode, and a second electrode positioned on the organic light emitting layer and connected with the subsidiary electrode.

Abstract: Provided is an organic light emitting device comprising: a substrate; and a plurality of sub-pixels, each sub-pixel comprising a thin film transistor formed on the substrate; a planarization layer formed on the thin film transistor, and having a contact hole exposing a portion of a source electrode or a drain electrode of the thin film transistor; a contact electrode formed on the planarization layer, and electrically connected with the source electrode or the drain electrode of the thin film transistor through the contact hole; a first electrode spaced apart from the contact electrode, the first electrode formed on the planarization layer; an insulating layer formed on the first electrode and the contact electrode, the insulating layer comprising a first opening exposing a portion of the first electrode and a second opening exposing a portion of the contact electrode; a light emitting layer formed in the first opening; a second electrode formed on the light emitting layer and electrically connected with a po

Abstract: Provided is an organic light emitting device comprising: a substrate; and a plurality of sub-pixels, each sub-pixel comprising a thin film transistor formed on the substrate; a planarization layer formed on the thin film transistor, and having a contact hole exposing a portion of a source electrode or a drain electrode of the thin film transistor; a contact electrode formed on the planarization layer, and electrically connected with the source electrode or the drain electrode of the thin film transistor through the contact hole; a first electrode spaced apart from the contact electrode, the first electrode formed on the planarization layer; an insulating layer formed on the first electrode and the contact electrode, the insulating layer comprising a first opening exposing a portion of the first electrode and a second opening exposing a portion of the contact electrode; a light emitting layer formed in the first opening; a second electrode formed on the light emitting layer and electrically connected with a po

Abstract: An organic light emitting display (OLED) includes a substrate, first and second driving units positioned on the substrate, a first light emitting diode (LED) connected with the first driving unit and including a first organic light emitting layer and a second emitting diode electrically connected with the second driving unit and including a second organic light emitting layer. The second emitting diode is positioned on the first emitting diode.

Abstract: A connector-type optical transceiver includes optical devices, a silicon-on-insulator (SOI) optical waveguide and a silicon bench whose upper surface is provided with a U-shaped recesses for receiving the optical devices and the SOI optical waveguide, while being aligned to form optical paths. The SOI optical waveguide includes a silicon substrate, a single crystalline silicon layer whose upper surface is provided with waveguide portions, and a silica thin layer interposed between the silicon substrate and the single crystalline silicon layer to prevent light passing through the waveguide portions from being diffused. The silicon bench has v-shaped grooves extending longitudinally along the silicon bench and receives guide pins adapted to guide an external connecting terminal to be connected to the silicon bench.

Abstract: A jig for the batch production of optical communication apparatuses includes a jig body whose upper surface is provided with a plurality of U-shaped recesses arranged in a matrix array to receive silicon bases each carrying optical devices and a plurality of vacuum holes vertically formed through the jig body, to communication with the respective bottom surfaces of the U-shaped recesses. The silicon bases received by the U-shaped recesses are held onto the bottom surfaces thereof when a vacuum is applied thereto through the vacuum holes. A method using the jig enables batch production by simultaneously processing many silicon bases.