Patents by Inventor Dragoljub Veljanovic

Dragoljub Veljanovic has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10636763
    Abstract: An approach to provide an electronic assembly process that includes receiving at least one electronic assembly after a solder reflow process using a Sn-containing solder and a water-soluble flux. The approach includes baking the at least one electronic assembly in an oxygen containing environment and, then cleaning the at least one electronic assembly in an aqueous cleaning process.
    Type: Grant
    Filed: September 15, 2017
    Date of Patent: April 28, 2020
    Assignee: International Business Machines Corporation
    Inventors: Charles C. Bureau, Eric Duchesne, Kang-Wook Lee, Isabelle Paquin, Dragoljub Veljanovic
  • Publication number: 20180005975
    Abstract: An approach to provide an electronic assembly process that includes receiving at least one electronic assembly after a solder reflow process using a Sn-containing solder and a water-soluble flux. The approach includes baking the at least one electronic assembly in an oxygen containing environment and, then cleaning the at least one electronic assembly in an aqueous cleaning process.
    Type: Application
    Filed: September 15, 2017
    Publication date: January 4, 2018
    Inventors: Charles C. Bureau, Eric Duchesne, Kang-Wook Lee, Isabelle Paquin, Dragoljub Veljanovic
  • Patent number: 9818717
    Abstract: An approach to provide an electronic assembly process that includes receiving at least one electronic assembly after a solder reflow process using a Sn-containing solder and a water-soluble flux. The approach includes baking the at least one electronic assembly in an oxygen containing environment and, then cleaning the at least one electronic assembly in an aqueous cleaning process.
    Type: Grant
    Filed: February 24, 2016
    Date of Patent: November 14, 2017
    Assignee: International Business Machines Corporation
    Inventors: Charles C. Bureau, Eric Duchesne, Kang-Wook Lee, Isabelle Paquin, Dragoljub Veljanovic
  • Publication number: 20170243852
    Abstract: An approach to provide an electronic assembly process that includes receiving at least one electronic assembly after a solder reflow process using a Sn-containing solder and a water-soluble flux. The approach includes baking the at least one electronic assembly in an oxygen containing environment and, then cleaning the at least one electronic assembly in an aqueous cleaning process.
    Type: Application
    Filed: February 24, 2016
    Publication date: August 24, 2017
    Inventors: Charles C. Bureau, Eric Duchesne, Kang-Wook Lee, Isabelle Paquin, Dragoljub Veljanovic