Patents by Inventor Dragos Dimitriu
Dragos Dimitriu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11626886Abstract: Methods, systems, and devices for thermometer coding for driving non-binary signals are described. A set of drivers may be used to drive a signal line, with each of the drivers calibrated to have different individual drive strengths. To drive a signal line to successive voltages in accordance with a non-binary modulation scheme, additional individual drivers of the set may be used. The different drive strengths of the individual drivers of the set may scale in non-linear fashion, which may offset non-linearities associated with the individual drivers as additional individual drivers of the set are activated.Type: GrantFiled: July 21, 2021Date of Patent: April 11, 2023Assignee: Micron Technology, Inc.Inventor: Dragos Dimitriu
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Patent number: 11621038Abstract: Methods, systems, and devices related to an improved driver for non-binary signaling are described. A driver for a signal line may include a set of drivers of a first type and a set of drivers of a second type. When the driver drives the signal line using multiple drivers of the first type, at least one additional driver of the first type may compensate for non-linearities associated with one or more other drivers of the first type, which may have been calibrated at other voltages. The at least one additional driver of the first type may be calibrated for use at a particular voltage, to compensate for non-linearities associated with the one or more other drivers of the first type as exhibited at that particular voltage.Type: GrantFiled: July 21, 2021Date of Patent: April 4, 2023Assignee: Micron Technology, Inc.Inventors: Shindeok Kang, Timothy M. Hollis, Dragos Dimitriu
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Publication number: 20230027926Abstract: Methods, systems, and devices related to an improved driver for non-binary signaling are described. A driver for a signal line may include a set of drivers of a first type and a set of drivers of a second type. When the driver drives the signal line using multiple drivers of the first type, at least one additional driver of the first type may compensate for non-linearities associated with one or more other drivers of the first type, which may have been calibrated at other voltages. The at least one additional driver of the first type may be calibrated for use at a particular voltage, to compensate for non-linearities associated with the one or more other drivers of the first type as exhibited at that particular voltage.Type: ApplicationFiled: July 21, 2021Publication date: January 26, 2023Inventors: Shindeok Kang, Timothy M. Hollis, Dragos Dimitriu
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Publication number: 20230025764Abstract: Methods, systems, and devices for thermometer coding for driving non-binary signals are described. A set of drivers may be used to drive a signal line, with each of the drivers calibrated to have different individual drive strengths. To drive a signal line to successive voltages in accordance with a non-binary modulation scheme, additional individual drivers of the set may be used. The different drive strengths of the individual drivers of the set may scale in non-linear fashion, which may offset non-linearities associated with the individual drivers as additional individual drivers of the set are activated.Type: ApplicationFiled: July 21, 2021Publication date: January 26, 2023Inventor: Dragos Dimitriu
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Patent number: 10861531Abstract: Apparatuses and methods for providing additional drive to multilevel signals representing data are described. An example apparatus includes a first driver section, a second driver section, and a third driver section. The first driver section is configured to drive an output terminal toward a first selected one of a first voltage and a second voltage. The second driver section configured to drive the output terminal toward a second selected one of the first voltage and the second voltage. The third driver section configured to drive the output terminal toward the first voltage when each of the first selected one and the second selected one is the first voltage. The third driver circuit is further configured to be in a high impedance state when the first selected one and the second selected one are different from each other.Type: GrantFiled: April 4, 2019Date of Patent: December 8, 2020Assignee: Micron Technology, Inc.Inventors: Timothy M. Hollis, Dragos Dimitriu
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Patent number: 10629502Abstract: A stack of vertically-connected, horizontally-oriented integrated circuits (ICs) may have electrical connections from the front side of one IC to the back side of another IC. Electrical signals may be transferred from the back side of one IC to the front side of the same IC by means of through substrate vias (TSVs), which may include through silicon vias. Electronic apparatus, systems, and methods may operate to test and/or replace defective TSVs. Additional apparatus, systems and methods are disclosed.Type: GrantFiled: July 6, 2018Date of Patent: April 21, 2020Assignee: Micron Technology, Inc.Inventors: Ebrahim H Hargan, Layne Bunker, Dragos Dimitriu, Gregory A. King
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Publication number: 20190237125Abstract: Apparatuses and methods for providing additional drive to multilevel signals representing data are described. An example apparatus includes a first driver section, a second driver section, and a third driver section. The first driver section is configured to drive an output terminal toward a first selected one of a first voltage and a second voltage. The second driver section configured to drive the output terminal toward a second selected one of the first voltage and the second voltage. The third driver section configured to drive the output terminal toward the first voltage when each of the first selected one and the second selected one is the first voltage. The third driver circuit is further configured to be in a high impedance state when the first selected one and the second selected one are different from each other.Type: ApplicationFiled: April 4, 2019Publication date: August 1, 2019Applicant: MICRON TECHNOLOGY, INC.Inventors: Timothy M. Hollis, Dragos Dimitriu
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Patent number: 10348532Abstract: Various embodiments include apparatus and methods having a data receiver with a real time clock decoding decision feedback equalizer. In various embodiments, a digital decision feedback loop can be implemented in a data receiver circuit, while all analog signals involved are static relative to the input signal data rate. The implemented data receiver circuit can include a number of data latches with different, but static, analog unbalances and a decision-based clock decoder. In an example, the analog unbalances may be different reference voltages. The decision-based clock decoder can be structured to activate only one data latch, the one with the desired analog unbalance. The outputs of the latches attached to the same clock decoder can be combined such that only the active latch drives the final output. Additional apparatus, systems, and methods are disclosed.Type: GrantFiled: September 11, 2018Date of Patent: July 9, 2019Assignee: Micron Technology, Inc.Inventor: Dragos Dimitriu
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Patent number: 10283187Abstract: Apparatuses and methods for providing additional drive to multilevel signals representing data are described. An example apparatus includes a first driver section, a second driver section, and a third driver section. The first driver section is configured to drive an output terminal toward a first selected one of a first voltage and a second voltage. The second driver section configured to drive the output terminal toward a second selected one of the first voltage and the second voltage. The third driver section configured to drive the output terminal toward the first voltage when each of the first selected one and the second selected one is the first voltage. The third driver circuit is further configured to be in a high impedance state when the first selected one and the second selected one are different from each other.Type: GrantFiled: October 13, 2017Date of Patent: May 7, 2019Assignee: Micron Technology, Inc.Inventors: Timothy M. Hollis, Dragos Dimitriu
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Publication number: 20190109057Abstract: A stack of vertically-connected, horizontally-oriented integrated circuits (ICs) may have electrical connections from the front side of one IC to the back side of another IC. Electrical signals may be transferred from the back side of one IC to the front side of the same IC by means of through substrate vias (TSVs), which may include through silicon vias. Electronic apparatus, systems, and methods may operate to test and/or replace defective TSVs. Additional apparatus, systems and methods are disclosed.Type: ApplicationFiled: July 6, 2018Publication date: April 11, 2019Inventors: Ebrahim H. Hargan, Layne Bunker, Dragos Dimitriu, Gregory A. King
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Publication number: 20190036743Abstract: Various embodiments include apparatus and methods having a data receiver with a real time clock decoding decision feedback equalizer. In various embodiments, a digital decision feedback loop can be implemented in a data receiver circuit, while all analog signals involved are static relative to the input signal data rate. The implemented data receiver circuit can include a number of data latches with different, but static, analog unbalances and a decision-based clock decoder. In an example, the analog unbalances may be different reference voltages. The decision-based clock decoder can be structured to activate only one data latch, the one with the desired analog unbalance. The outputs of the latches attached to the same clock decoder can be combined such that only the active latch drives the final output. Additional apparatus, systems, and methods are disclosed.Type: ApplicationFiled: September 11, 2018Publication date: January 31, 2019Inventor: Dragos Dimitriu
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Publication number: 20190027205Abstract: Apparatuses and methods for providing additional drive to multilevel signals representing data are described. An example apparatus includes a first driver section, a second driver section, and a third driver section. The first driver section is configured to drive an output terminal toward a first selected one of a first voltage and a second voltage. The second driver section configured to drive the output terminal toward a second selected one of the first voltage and the second voltage. The third driver section configured to drive the output terminal toward the first voltage when each of the first selected one and the second selected one is the first voltage. The third driver circuit is further configured to be in a high impedance state when the first selected one and the second selected one are different from each other.Type: ApplicationFiled: October 13, 2017Publication date: January 24, 2019Applicant: MICRON TECHNOLOGY, INC.Inventors: Timothy M. Hollis, Dragos Dimitriu
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Patent number: 10091031Abstract: Various embodiments include apparatus and methods having a data receiver with a real time clock decoding decision feedback equalizer. In various embodiments, a digital decision feedback loop can be implemented in a data receiver circuit, while all analog signals involved are static relative to the input signal data rate. The implemented data receiver circuit can include a number of data latches with different, but static, analog unbalances and a decision-based clock decoder. In an example, the analog unbalances may be different reference voltages. The decision-based clock decoder can be structured to activate only one data latch, the one with the desired analog unbalance. The outputs of the latches attached to the same clock decoder can be combined such that only the active latch drives the final output. Additional apparatus, systems, and methods are disclosed.Type: GrantFiled: July 31, 2017Date of Patent: October 2, 2018Assignee: Micron Technology, Inc.Inventor: Dragos Dimitriu
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Patent number: 10037926Abstract: A stack of vertically-connected, horizontally-oriented integrated circuits (ICs) may have electrical connections from the front side of one IC to the back side of another IC. Electrical signals may be transferred from the back side of one IC to the front side of the same IC by means of through substrate vias (TSVs), which may include through silicon vias. Electronic apparatus, systems, and methods may operate to test and/or replace defective TSVs. Additional apparatus, systems and methods are disclosed.Type: GrantFiled: April 18, 2016Date of Patent: July 31, 2018Assignee: Micron Technology, Inc.Inventors: Ebrahim H Hargan, Layne Bunker, Dragos Dimitriu, Gregory A. King
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Publication number: 20160233136Abstract: A stack of vertically-connected, horizontally-oriented integrated circuits (ICs) may have electrical connections from the front side of one IC to the back side of another IC. Electrical signals may be transferred from the back side of one IC to the front side of the same IC by means of through substrate vias (TSVs), which may include through silicon vias. Electronic apparatus, systems, and methods may operate to test and/or replace defective TSVs. Additional apparatus, systems and methods are disclosed.Type: ApplicationFiled: April 18, 2016Publication date: August 11, 2016Inventors: Ebrahim H. Hargan, Layne Bunker, Dragos Dimitriu, Gregory A. King
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Patent number: 9331646Abstract: Apparatuses and methods are disclosed, including an apparatus with a first differential amplifier to amplify an input signal into a first output signal, a second differential amplifier to amplify the input signal into a second output signal that is complementary to the first output signal, and a feedback resistance coupled between the first output signal and the second output signal. Additional apparatuses and methods are described.Type: GrantFiled: January 5, 2015Date of Patent: May 3, 2016Assignee: Micron Technology, Inc.Inventors: Jennifer Taylor, Dragos Dimitriu
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Patent number: 9318394Abstract: A stack of vertically-connected, horizontally-oriented integrated circuits (ICs) may have electrical connections from the front side of one IC to the back side of another IC. Electrical signals may be transferred from the back side of one IC to the front side of the same IC by means of through substrate vias (TSVs), which may include through silicon vias. Electronic apparatus, systems, and methods may operate to test and/or replace defective TSVs. Additional apparatus, systems and methods are disclosed.Type: GrantFiled: September 23, 2014Date of Patent: April 19, 2016Assignee: Micron Technology, Inc.Inventors: Ebrahim H Hargan, Layne Bunker, Dragos Dimitriu, Gregory A. King
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Patent number: 9244477Abstract: An improved reference voltage (Vref) generator useable, for example, in sensing data on single-ended channels is disclosed. The Vref generator can be placed on the integrated circuit containing the receivers, or may be placed off chip. In one embodiment, the Vref generator comprises an adjustable-resistance voltage divider in combination with a current source. The voltage divider is referenced to I/O power supplies Vddq and Vssq, with Vref being generated at a node intervening between the adjustable resistances of the voltage divider. The current source injects a current into the Vref node and into a non-varying Thevenin equivalent resistance formed of the same resistors used in the voltage divider. So constructed, the voltage generated equals the sum of two terms: a first term comprising the slope between Vref and Vddq, and a second term comprising a Vref offset.Type: GrantFiled: October 21, 2013Date of Patent: January 26, 2016Assignee: Micron Technology, Inc.Inventors: Dragos Dimitriu, Timothy Hollis
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Publication number: 20150116034Abstract: Apparatuses and methods are disclosed, including an apparatus with a first differential amplifier to amplify an input signal into a first output signal, a second differential amplifier to amplify the input signal into a second output signal that is complementary to the first output signal, and a feedback resistance coupled between the first output signal and the second output signal. Additional apparatuses and methods are described.Type: ApplicationFiled: January 5, 2015Publication date: April 30, 2015Inventors: Jennifer Taylor, Dragos Dimitriu
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Publication number: 20150008953Abstract: A stack of vertically-connected, horizontally-oriented integrated circuits (ICs) may have electrical connections from the front side of one IC to the back side of another IC. Electrical signals may be transferred from the back side of one IC to the front side of the same IC by means of through substrate vias (TSVs), which may include through silicon vias. Electronic apparatus, systems, and methods may operate to test and/or replace defective TSVs. Additional apparatus, systems and methods are disclosed.Type: ApplicationFiled: September 23, 2014Publication date: January 8, 2015Inventors: Ebrahim H. Hargan, Layne Bunker, Dragos Dimitriu, Gregory A. King