Patents by Inventor Drew Campbell

Drew Campbell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Broadband unmanned aerial vehicle (UAV) patch antenna
    Patent number: 10734716
    Abstract: Embodiments of the present disclosure relate to a UAV comprising a fuselage, a rotor, and a patch antenna element. The patch antenna element, which is provided from a patch antenna stack-up, is conformally disposed on an outer surface of the UAV's fuselage. The patch antenna comprises a first substrate, patch conductor, intermediate substrate, bottom substrate, and ground plane. The patch conductor is disposed on a top surface of the first substrate. A first surface of the intermediate substrate, which is a magneto-dielectric material, is disposed on a bottom surface of the first substrate. A top surface of the bottom substrate is disposed on a second surface of the intermediate substrate. A ground plane conductor is disposed on a bottom surface of the bottom substrate.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: August 4, 2020
    Assignee: Raytheon Company
    Inventors: Chad Wangsvick, Drew Campbell
  • BROADBAND UNMANNED AERIAL VEHICLE (UAV) PATCH ANTENNA
    Publication number: 20200144704
    Abstract: Embodiments of the present disclosure relate to a UAV comprising a fuselage, a rotor, and a patch antenna element. The patch antenna element, which is provided from a patch antenna stack-up, is conformally disposed on an outer surface of the UAV's fuselage. The patch antenna comprises a first substrate, patch conductor, intermediate substrate, bottom substrate, and ground plane. The patch conductor is disposed on a top surface of the first substrate. A first surface of the intermediate substrate, which is a magneto-dielectric material, is disposed on a bottom surface of the first substrate. A top surface of the bottom substrate is disposed on a second surface of the intermediate substrate. A ground plane conductor is disposed on a bottom surface of the bottom substrate.
    Type: Application
    Filed: November 2, 2018
    Publication date: May 7, 2020
    Applicant: Raytheon Company
    Inventors: Chad Wangsvick, Drew Campbell