Abstract: A system for conditioning a sensor die. The sensor die may have a sensor wafer and a substrate wafer anodically bonded together. The sensor die may have an inertial device such as an accelerometer or a gyroscope. The device has a scale factor that may change with a bowing of the sensor die. The die may be bonded at a high temperature to bumps on a surface of a package, but may develop a bow when cooled down to a temperature such as room temperature when the coefficients of thermal expansion of the die and the package are different. The bump material may enter a yield state. The package and the die may be subjected to a high gravity environment to reduce or reverse the bow. After the package is removed from the high gravity environment, the bow may return but at a smaller magnitude when subject to similar conditions.

Abstract: Methods and systems for controlling the internal dampening of MEMS sensors is provided. In one illustrative embodiment, a MEMS sensor is provide that can be tunable to a desired Q value, and the Q value may be held relatively constant over the expected life of the sensor. The MEMS sensor package may include a chamber that houses a MEMS sensor. An inert gas may be provided in the chamber at a desired or specified pressure, wherein the inert gas may be backfilled into the chamber after the chamber is evacuated. The pressure of the inert gas may be set to achieve a desired Q value.