Abstract: Consistent with an aspect of the present disclosure, an exemplary digital communication system is provided that includes redundant or spare transceivers to handle failure events. In one example, if one of the first N+r transceivers experience a failure, spatial FEC codewords can correct the resulting bit errors and, as previously mentioned, prevent post-FEC errors from occurring. In embodiments, if a primary transceiver fails, a redundant transceiver may be activated to take its place.

Abstract: Consistent with the present disclosure, a scalable high density package is provided in which peripheral devices are provided within the same footprint or area as core logic, e.g., switching circuitry by providing the peripheral devices can be placed on the top or bottom of one or more core-I/O chips. In addition, a liquid cooled heatsink may be provided, in one example, between the core-I/O chips and the peripheral devices. A substrate, such as a printed circuit board may also be provided, such that the core-I/O chips and heatsink are provided on one side of the substrate and power supplies are provided on the other side. Conductors provided in vias that extend through the heatsink deliver power, such as a current, to the core-VO chips and the peripheral devices. Each of the foregoing circuits, therefore, is provided in a vertical arrangement to thereby provide reduce the size of the package.

Abstract: A digital optical network (DON) is a new approach to low-cost, more compact optical transmitter modules and optical receiver modules for deployment in optical transport networks (OTNs). One important aspect of a digital optical network is the incorporation in these modules of transmitter photonic integrated circuit (TxPIC) chips and receiver photonic integrated circuit (TxPIC) chips in lieu of discrete modulated sources and detector sources with discrete multiplexers or demultiplexers.

Abstract: A digital optical network (DON) is a new approach to low-cost, more compact optical transmitter modules and optical receiver modules for deployment in optical transport networks (OTNs). One important aspect of a digital optical network is the incorporation in these modules of transmitter photonic integrated circuit (TxPIC) chips and receiver photonic integrated circuit (TxPIC) chips in lieu of discrete modulated sources and detector sources with discrete multiplexers or demultiplexers.

Abstract: An optical transmission network is inherently asynchronous due to the utilization of a variable overhead ratio (V-OHR). The network architecture makes extensive use of OEO regeneration, i.e., deals with any electronic reconditioning to correct for transmission impairments, such as, for example, FEC encoding, decoding and re-encoding, signal reshaping, retiming as well as signal regeneration. The optical transmission network includes a plesiochronous clocking system with intermediate nodes designed to operate asynchronously with a single local frequency clock without complicated network synchronization schemes employing high cost clocking devices such as phase locked loop (PLL) control with crystal oscillators and other expensive system components.

Abstract: An optical transmission network is inherently asynchronous due to the utilization of a variable overhead ratio (V-OHR). The network architecture makes extensive use of OEO regeneration, i.e., deals with any electronic reconditioning to correct for transmission impairments, such as, for example, FEC encoding, decoding and re-encoding, signal reshaping, retiming as well as signal regeneration. The optical transmission network includes a plesiochronous clocking system with intermediate nodes designed to operate asynchronously with a single local frequency clock without complicated network synchronization schemes employing high cost clocking devices such as phase locked loop (PLL) control with crystal oscillators and other expensive system components.

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract: The present invention provides a system, apparatus and method for modularly adapting a network node architecture to function in one of a plurality of potential node types. The architecture includes a configurable switching element, integrated optics, and a plurality of modules that allow a “type” of node to be adapted and configured within the base architecture. The module interfaces may be optical or electrical and be used to construct various different types of nodes including regenerators, add/drop nodes, terminal nodes, and multi-way nodes using the same base architecture.

Abstract: Client signals to be transported in a transmission network, particularly an optical transmission network, may have different payload envelope rates and are digitally mapped on the client egress side into first transport frames (also referred to as iDTF frames, or intra-node or internal digital transport frames), at the client side for intra-transport within terminal network elements (NEs) and further digitally mapped into second transport frames (also referred to as DTFs or digital transport frames) for inter-transport across the network or a link which, through byte stuffing carried out in the first transport frames so that they always have the same frame size. As a result, the system of framers provides for a DTF format to always have a uniformly universal frame rate throughout the network supporting any client signal frequency, whether a standard client payload or a proprietary client payload, as long as its rate is below payload envelope rate of the client signal.

Abstract: A coolerless photonic integrated circuit (PIC), such as a semiconductor electro-absorption modulator/laser (EML) or a coolerless optical transmitter photonic integrated circuit (TxPIC), may be operated over a wide temperature range at temperatures higher then room temperature without the need for ambient cooling or hermetic packaging. Since there is large scale integration of N optical transmission signal WDM channels on a TxPIC chip, a new DWDM system approach with novel sensing schemes and adaptive algorithms provides intelligent control of the PIC to optimize its performance and to allow optical transmitter and receiver modules in DWDM systems to operate uncooled. Moreover, the wavelength grid of the on-chip channel laser sources may thermally float within a WDM wavelength band where the individual emission wavelengths of the laser sources are not fixed to wavelength peaks along a standardized wavelength grid but rather may move about with changes in ambient temperature.

Abstract: An optical equalizer/dispersion compensator (E/CDC) comprises an input/output for receiving a multiplexed channel signal comprising a plurality of channel signals of different wavelengths. An optical amplifier may be coupled to receive, as an input/output, the multiplexed channel signals which amplifier may be a semiconductor optical amplifier (SOA) or a gain clamped-semiconductor optical amplifier (GC-SOA). A variable optical attenuator (VOA) is coupled to the optical amplifier and a chromatic dispersion compensator (CDC) is coupled to the variable optical attenuator.