Patents by Inventor Druce Kirk Crump

Druce Kirk Crump has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5859273
    Abstract: Polyamino disuccinic acids are effective chelants for use in photography and gas conditioning (both applications preferably involving the polyamino disuccinic acid in the form of a metal, preferably an iron complex). The copper chelates are also useful in electroless copper plating. In photography, the invention includes a method of bleaching or bleach-fixing a photographic material which comprises contacting said material with a bleaching solution containing a bleaching agent comprising a ferric complex of a polyamino disuccinic acid and the solution so used. In electroless desposition, the invention includes a method of electroless deposition of copper upon a non-metallic surface receptive to the deposited copper including a step of contacting the non-metallic surface with an aqueous solution comprising a soluble copper salt and a polyamino disuccinic acid and plating baths appropriate for such use.
    Type: Grant
    Filed: October 23, 1996
    Date of Patent: January 12, 1999
    Assignee: The Dow Chemical Company
    Inventors: David Alan Wilson, Druce Kirk Crump
  • Patent number: 5741555
    Abstract: Polyamino disuccinic acids are effective chelants for use in photography and gas conditioning (both applications preferably involving the polyamino disuccinic acid in the form of a metal, preferably an iron complex). The copper chelates are also useful in electroless copper plating. In photography, the invention includes a method of bleaching or bleach-fixing a photographic material which comprises contacting said material with a bleaching solution containing a bleaching agent comprising a ferric complex of a polyamino disuccinic acid and the solution so used. In electroless deposition, the invention includes a method of electroless deposition of copper upon a non-metallic surface receptive to the deposited copper including a step of contacting the non-metallic surface with an aqueous solution comprising a soluble copper salt and a polyamino disuccinic acid and plating baths appropriate for such use.
    Type: Grant
    Filed: October 23, 1996
    Date of Patent: April 21, 1998
    Assignee: The Dow Chemical Company
    Inventors: David Alan Wilson, Druce Kirk Crump