Patents by Inventor Drusilla Bertone Cursi

Drusilla Bertone Cursi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for underfilling semiconductor devices
    Patent number: 6352423
    Abstract: A method and apparatus for underfilling a gap between a multi-sided semiconductor device and a substrate with viscous underfill material. The viscous underfill material is moved into the gap to encapsulate a plurality of electrical interconnections formed between the semiconductor device and the substrate. A seal is provided between the semiconductor device and the substrate to seal the gap along multiple sides of the device, while the gap is left unsealed along at least one side of the device to permit fluid communication with the gap. The viscous underfill material is dispensed adjacent the at least one side of the device along which the gap is unsealed, and a pressure differential is created across the underfill material to draw the underfill material into the gap and thereby encapsulate the electrical interconnections.
    Type: Grant
    Filed: May 8, 2000
    Date of Patent: March 5, 2002
    Assignee: Nordson Corporation
    Inventors: Alec J. Babiarz, Carlos Edward Bouras, Drusilla Bertone Cursi, Alan Ray Lewis, Jason Thomas Vint
  • Method for underfilling semiconductor devices
    Patent number: 6255142
    Abstract: A method and apparatus for underfilling a gap between a multi-sided semiconductor device and a substrate with viscous underfill material. The viscous underfill material is moved into the gap to encapsulate a plurality of electrical interconnections formed between the semiconductor device and the substrate. A seal is provided between the semiconductor device and the substrate to seal the gap along multiple sides of the device, while the gap is left unsealed along at least one side of the device to permit fluid communication with the gap. The viscous underfill material is dispensed adjacent the at least one side of the device along which the gap is unsealed, and a pressure differential is created across the underfill material to draw the underfill material into the gap and thereby encapsulate the electrical interconnections.
    Type: Grant
    Filed: October 29, 1999
    Date of Patent: July 3, 2001
    Assignee: Nordson Corporation
    Inventors: Alec J. Babiarz, Carlos Edward Bouras, Drusilla Bertone Cursi, Alan Ray Lewis, Jason Thomas Vint