Patents by Inventor Du Chen

Du Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate within a Ni/Au structure electroplated on electrical contact pads and method for fabricating the same
    Publication number: 20030122256
    Abstract: The present invention discloses a substrate within a Ni/Au structure electroplated on electrical contact pads and a method for fabricating the same. The method comprises: providing a substrate with a circuit layout pattern and forming a conducting film on the surface of the substrate; depositing a first photoresist layer within an opening on said electrical conducting film surface to expose a portion of said circuit layout pattern to be electrical contact pads; removing the exposed conducting film uncovered by the first photoresist layer; depositing a second photoresist layer, covering the conducting film exposed in the openings of the first photoresist layer; electroplating Ni/Au covering the surface of the electrical contact pads; removing the first and second photoresists, and the conducting film covered by the photoresists; depositing solder mask on the substrate within an opening to expose said electrical contact pads.
    Type: Application
    Filed: February 10, 2003
    Publication date: July 3, 2003
    Applicant: Phoenix Precision Technology Corp.
    Inventors: Shih-Ping Hsu, Chiang-Du Chen, Yen-Hung Liu
  • Method for fabricating substrate within a Ni/Au structure electroplated on electrical contact pads
    Patent number: 6576540
    Abstract: The present invention discloses a substrate within a Ni/Au structure electroplated on electrical contact pads and a method for fabricating the same. The method comprises: providing a substrate with a circuit layout pattern and forming a conducting film on the surface of the substrate; depositing a first photoresist layer within an opening on said electrical conducting film surface to expose a portion of said circuit layout pattern to be electrical contact pads; removing the exposed conducting film uncovered by the first photoresist layer; depositing a second photoresist layer, covering the conducting film exposed in the openings of the first photoresist layer; electroplating Ni/Au covering the surface of the electrical contact pads; removing the first and second photoresists, and the conducting film covered by the photoresists; depositing solder mask on the substrate within an opening to expose said electrical contact pads.
    Type: Grant
    Filed: March 22, 2002
    Date of Patent: June 10, 2003
    Assignee: Phoenix Precision Technology Corporation
    Inventors: Shih-Ping Hsu, Chiang-Du Chen, Yen-Hung Liu
  • Substrate within a Ni/Au structure electroplated on electrical contact pads and method for fabricating the same
    Publication number: 20020190378
    Abstract: The present invention discloses a substrate within a Ni/Au structure electroplated on electrical contact pads and a method for fabricating the same. The method comprises: providing a substrate with a circuit layout pattern and forming a conducting film on the surface of the substrate; depositing a first photoresist layer within an opening on said electrical conducting film surface to expose a portion of said circuit layout pattern to be electrical contact pads; removing the exposed conducting film uncovered by the first photoresist layer; depositing a second photoresist layer, covering the conducting film exposed in the openings of the first photoresist layer; electroplating Ni/Au covering the surface of the electrical contact pads; removing the first and second photoresists, and the conducting film covered by the photoresists; depositing solder mask on the substrate within an opening to expose said electrical contact pads.
    Type: Application
    Filed: March 22, 2002
    Publication date: December 19, 2002
    Inventors: Shih-Ping Hsu, Chiang-Du Chen, Yen-Hung Liu