Patents by Inventor Du-hyun Lee

Du-hyun Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080061214
    Abstract: A nano-imprint mold and a method of manufacturing the same are provided, which can be used for replicating a nano-scaled structure to a polymer layer. The nano-imprint mold comprises: a substrate; a pattern portion having a prominence and depression pattern formed on the substrate; a hard layer formed of a material with a hardness higher than the pattern portion on a surface of the pattern portion; and a separation layer formed on a surface of the hard layer. In the nano-imprint mold of the present invention, an original pattern can be uniformly replicated even on a substrate with an irregular surface. Further, the pattern can be prevented from being damaged by pressure and being contaminated by synthetic resin, resulting in better accuracy and durability of the pattern.
    Type: Application
    Filed: February 26, 2007
    Publication date: March 13, 2008
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Du Hyun Lee, Jin Seung Sohn, Byung Kyu Lee, Eun Hyoung Cho
  • Publication number: 20080050616
    Abstract: Provided are a method of manufacturing a magnetic layer, a patterned magnetic recording medium including magnetic layers formed using the method, and a method of manufacturing the patterned magnetic recording medium. The method of manufacturing the magnetic layers includes: forming a template provided with an opening; forming a seed layer on a bottom of the opening; and inserting a magnetic material onto the seed layer to form a magnetic layer. The patterned magnetic recording medium includes a lower layer formed on a substrate; a template formed on the lower layer and including a plurality of holes exposing the lower layer; seed layers covering the lower layer exposed through the holes; and magnetic layers formed on the seed layers to fill the holes.
    Type: Application
    Filed: March 5, 2007
    Publication date: February 28, 2008
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Myung-bok Lee, Jin-seung Sohn, Byung-kyu Lee, Du-hyun Lee