Abstract: A polishing platen of a chemical mechanical polishing apparatus and a planarization method using the same are disclosed. The polishing platen is formed of a first plate connected to a second plate. By independently controlling a thermal expansion of the first and second plates, a shape of an upper surface of the platen can be controlled and selectively altered. This allows a more precise polishing process and formation of a more uniform wafer. In one embodiment, the first and second plates, each have a different thermal expansion coefficient.