Abstract: There is provided a semiconductor package comprising: a chip mounted on a substrate; and at least one solder ball formed under the substrate, wherein the solder ball comprises: a solder layer; a shell surrounded by the solder layer; and a phase change material contained in the shell.

Abstract: A mobile device may include: an interface unit configured to receive first uniform resource locator (URL) information from a user, and configured to receive second URL information; a web data loading unit configured to load a first web page corresponding to the first URL information, and configured to load a second web page corresponding to the second URL information; a determining unit configured to compare the first and second URL information to determine whether the first web page is related to the second web page and to generate a first control signal; a scale control unit configured to generate a scale control signal corresponding to scale information of the first web page in response to the first control signal; and/or a display unit configured to receive the scale control signal to display the second web page in a scale corresponding to the scale information of the first web page.

Abstract: A printed circuit board and a semiconductor package using the same. The semiconductor package includes a printed circuit board (PCB) and a semiconductor chip mounted on the PCB. The printed circuit board includes a base substrate that has a first surface and a second surface which are positioned opposite to each other, and has through-holes, the first surface having a concave-convex portion, an adhesive layer that is disposed on the second surface of the base substrate, a wiring layer that is attached to the second surface of the base substrate by the adhesive layer and that comprises exposed portions exposed through the through-holes, an adhesive member that is disposed on the first surface of the base substrate and adheres the semiconductor chip to the first surface, and electrical connection members that electrically connect the wiring layer with the semiconductor chip.

Abstract: A molding material used to fabricate a semiconductor package, a method of fabricating the molding composition, and a semiconductor package obtained by using the molding composition are disclosed. A molding composition includes a molding resin material, a filler, and a water absorption material coated on a surface of the filler, such that an amount of external moisture penetrating into the semiconductor package may be diminished. A semiconductor package includes a substrate, at least one chip mounted on the substrate, a connecting portion electrically connecting the at least one chip and the substrate, and a molding portion encapsulating the at least one chip on the substrate, wherein the molding portion includes a molding composition including a molding resin material, a filler, and a water absorption material coated on a surface of the filler, such that an amount of external moisture penetrating into the semiconductor package may be diminished.

Abstract: A printed circuit board and a semiconductor package using the same. The semiconductor package includes a printed circuit board (PCB) and a semiconductor chip mounted on the PCB. The printed circuit board includes a base substrate that has a first surface and a second surface which are positioned opposite to each other, and has through-holes, the first surface having a concave-convex portion, an adhesive layer that is disposed on the second surface of the base substrate, a wiring layer that is attached to the second surface of the base substrate by the adhesive layer and that comprises exposed portions exposed through the through-holes, an adhesive member that is disposed on the first surface of the base substrate and adheres the semiconductor chip to the first surface, and electrical connection members that electrically connect the wiring layer with the semiconductor chip.