Patents by Inventor Du Quy Le

Du Quy Le has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9919553
    Abstract: The present invention is directed to an embossing tool having a microstructure on its surface wherein the surface of the embossing tool has a thin layer of gold or an alloy thereof. Such an embossing tool not only can reduce adhesion between the surface of the embossing tool and a cured material, but also does not cause any significant change to the profile of the microstructure.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: March 20, 2018
    Assignee: E INK CALIFORNIA, LLC
    Inventors: Yih-Ming Kang, Du Quy Le, Hanan Liu, Yu Li, Donald A. Schultz
  • Publication number: 20160059617
    Abstract: The present invention is directed to an embossing tool having a microstructure on its surface wherein the surface of the embossing tool has a thin layer of gold or an alloy thereof. Such an embossing tool not only can reduce adhesion between the surface of the embossing tool and a cured material, but also does not cause any significant change to the profile of the microstructure.
    Type: Application
    Filed: August 31, 2015
    Publication date: March 3, 2016
    Inventors: Yih-Ming Kang, Du Quy LE, Hanan LIU, Yu LI, Donald A. Schultz
  • Publication number: 20160059442
    Abstract: The present invention is directed to an embossing tool having a microstructure on its surface wherein the surfaces of the microstructures are overcoated with a precious metal or an alloy thereof. Such an embossing tool not only can reduce adhesion between the surface of the embossing tool and a cured material, but also does not cause any significant change to the profile of the microstructure.
    Type: Application
    Filed: September 2, 2014
    Publication date: March 3, 2016
    Inventors: Yih-Ming KANG, Du Quy LE, Hanan LIU, Yu LI, Donald A. Schultz
  • Publication number: 20140050814
    Abstract: The invention is directed to an embossing assembly and methods for its preparation. The assembly comprises a drum, a non-expandable insert and an embossing sleeve and it is particularly useful for the preparation of microcups used in a display device. The assembly may also comprise only a drum and an embossing sleeve.
    Type: Application
    Filed: August 17, 2012
    Publication date: February 20, 2014
    Inventors: Gary Yih-Ming KANG, Hanan Liu, Du Quy Le