Abstract: Methods for treating at least one member of a backing element/microarray assembly structure are provided. The subject methods include at least one of: (1) depositing a component on the at least one member, (2) extracting a component from the at least one member, and (3) surface modifying the at least one member, to treat the at least one member of a backing element/microarray assembly structure. Embodiments of the subject invention also include treated microarray structure members, e.g., produced in accordance with the subject methods, as well as methods for using treated microarray structure members in array assay protocols. Also provided are systems and kits for use in the subject methods.