Patents by Inventor Duan Yi Wu

Duan Yi Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interconnection structure and method for manufacturing same
    Patent number: 10707117
    Abstract: The present disclosure teaches interconnection structures and methods for manufacturing the same.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: July 7, 2020
    Assignees: Semiconductor Manufacturing (Shanghai) International Corporation, Semiconductor Manufacturing (Beijing) International Corporation
    Inventors: Qiuhua Han, Kai Yan, Duan Yi Wu
  • INTERCONNECTION STRUCTURE AND METHOD FOR MANUFACTURING SAME
    Publication number: 20190181038
    Abstract: The present disclosure teaches interconnection structures and methods for manufacturing the same.
    Type: Application
    Filed: November 6, 2018
    Publication date: June 13, 2019
    Applicants: Semiconductor Manufacturing International (Beijing) Corporation, Semiconductor Manufacturing International (Shanghai) Corporation
    Inventors: Qiuhua Han, Kai Yan, Duan Yi Wu