Abstract: A V-panel filter apparatus and method of construction are provided. The method includes flowing curable potting material into a recess portion of an end cap, positioning first end edge surfaces of first and second filter panels into the contained potting material, and curing the potting material with the first and second filter panels positioned to diverge away from the end cap to define a V-shaped configuration. The method may include flowing curable potting material into a recess portion of a first side plate, positioning edge surfaces of the first and second filter panels into the contained potting material, and curing the potting material. Such steps may be repeated in relation to a second side plate and a header member. By utilizing a pot-and-place sealing methodology, improved seal interfaces are realized. Stability and construction advantages may be provided by snap-fit features of the header member and first and second side plates.

Abstract: A V-panel filter apparatus and method of construction are provided. The method includes flowing curable potting material into a recess portion of an end cap, positioning first end edge surfaces of first and second filter panels into the contained potting material, and curing the potting material with the first and second filter panels positioned to diverge away from the end cap to define a V-shaped configuration. The method may include flowing curable potting material into a recess portion of a first side plate, positioning edge surfaces of the first and second filter panels into the contained potting material, and curing the potting material. Such steps may be repeated in relation to a second side plate and a header member. By utilizing a pot-and-place sealing methodology, improved seal interfaces are realized. Stability and construction advantages may be provided by snap-fit features of the header member and first and second side plates.

Abstract: The subject invention is a method for processing a plastic packaged electronic device with soldered leads. The solder has a critical temperature which if exceeded more than once results in its oxidation. The method comprises protecting the device with a carrier, and baking the device and carrier in a low pressure environment and at a temperature sufficiently high enough to drive off moisture previously absorbed by the plastic but lower than the critical temperature of the solder.