Patents by Inventor Duane A. Hughes

Duane A. Hughes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130334673
    Abstract: Power module semiconductor packages that contain a flexible circuit board and methods for making such packages are described. The semiconductor package contain a flexible circuit board, a conductive film on a first portion of the upper surface of the flexible circuit board, a land pad on a second portion of the upper surface of the flexible circuit board, a heat sink on a portion of the bottom surface of the flexible circuit board, a passive component, a discrete device, or an IC device connected to a portion of the conductive film, and a lead of a lead frame connected to the land pad. These packages can have a high degree of design flexibility of the layout of the package and simpler routing designs, reducing the time to design the packages and reducing the costs of the packages. Other embodiments are also described.
    Type: Application
    Filed: June 13, 2012
    Publication date: December 19, 2013
    Inventor: Duane A. Hughes
  • Patent number: 8604610
    Abstract: Power module semiconductor packages that contain a flexible circuit board and methods for making such packages are described. The semiconductor package contain a flexible circuit board, a conductive film on a first portion of the upper surface of the flexible circuit board, a land pad on a second portion of the upper surface of the flexible circuit board, a heat sink on a portion of the bottom surface of the flexible circuit board, a passive component, a discrete device, or an IC device connected to a portion of the conductive film, and a lead of a lead frame connected to the land pad. These packages can have a high degree of design flexibility of the layout of the package and simpler routing designs, reducing the time to design the packages and reducing the costs of the packages. Other embodiments are also described.
    Type: Grant
    Filed: June 13, 2012
    Date of Patent: December 10, 2013
    Assignee: Fairchild Semiconductor Corporation
    Inventor: Duane A. Hughes
  • Patent number: 8139680
    Abstract: In an embodiment, a receiver includes an antenna configured to receive a communication frame. The communication frame may include an acquisition code symbol sequence, which in turn may include a plurality of acquisition code symbols. In an embodiment, an acquisition code symbol includes a subcode sequence having a plurality of subcodes. A receiver also may include a correlation calculator coupled to the antenna. The correlation calculator may be configured to determine a correlation between the subcodes of the received communication frame and a stored version of the subcodes. The correlation may be used in determining a timing offset for further processing of the communication frame.
    Type: Grant
    Filed: January 12, 2007
    Date of Patent: March 20, 2012
    Assignee: General Dynamics C4 Systems, Inc.
    Inventors: John Eric Kleider, Steve Henry Arneson, J. Scott Chuprun, Keith Matthew Nolan, Derrick Duane Hughes
  • Publication number: 20080170644
    Abstract: In an embodiment, a receiver includes an antenna configured to receive a communication frame. The communication frame may include an acquisition code symbol sequence, which in turn may include a plurality of acquisition code symbols. In an embodiment, an acquisition code symbol includes a subcode sequence having a plurality of subcodes. A receiver also may include a correlation calculator coupled to the antenna. The correlation calculator may be configured to determine a correlation between the subcodes of the received communication frame and a stored version of the subcodes. The correlation may be used in determining a timing offset for further processing of the communication frame.
    Type: Application
    Filed: January 12, 2007
    Publication date: July 17, 2008
    Applicant: GENERAL DYNAMICS C4 SYSTEMS, INC.
    Inventors: John Eric KLEIDER, Steve Henry ARNESON, J. Scott CHUPRUN, Keith Matthew NOLAN, Derrick Duane HUGHES