Abstract: A method of making a printed circuit board in which at least two circuitized substrates are aligned and bonded together (e.g., using lamination). A gasket is provided on one of these and a facing circuitized portion on the other. The gasket forms an effective seal about the circuitized portion to prevent heated dielectric material from contacting the circuitry. After bonding, parts of the bonded structure, including the gasket, are removed to leave a projecting edge portion having circuitry thereon. This edge portion is then adapted for being positioned within an edge connector.

Abstract: A method of making a printed circuit board in which at least two circuitized substrates are aligned and bonded together (e.g., using lamination). A gasket is provided on one of these and a facing circuitized portion on the other. The gasket forms an effective seal about the circuitized portion to prevent heated dielectric material from contacting the circuitry. After bonding, parts of the bonded structure, including the gasket, are removed to leave a projecting edge portion having circuitry thereon. This edge portion is then adapted for being positioned within an edge connector.

Abstract: A chip carrier which is employed in the industry for mounting integrated circuits and various types of electronic components on chips and is adapted to be positioned within a processing tray or carrier frame for shipping and processing purposes, and wherein the chip carrier is adapted to be precisely positioned and adhesively maintained in a fixed relationships in the carrier frame. Also disclosed is a method of manufacturing chip carrier arrays or strips which are adapted to be positioned in predetermined adhesively fixed relationships within a carrier frame or tray for processing and shipping purposes.