Abstract: A method of fabricating a plurality of integrated circuits on a substrate according to a first integrated circuit design. Each of the integrated circuits is formed with a plurality of layer patterns. At least one first layer pattern of the layer patterns is common with a second integrated circuit design, and at least one second layer pattern of the layer patterns is unique to the first integrated circuit design. The first layer pattern is imaged on the substrate using an exposure tool and a first mask having a first number of the first layer patterns formed in a block thereon. No other layer patterns of the first layer patterns and the second layer patterns are formed on the first mask. The first number is less than the plurality of integrated circuits formed on the substrate. The first layer patterns are imaged on the substrate by exposing and repeating the block of first number of first layer patterns across the substrate with the exposure tool.

Abstract: A mask for exposing a first layer and a second layer on a process substrate, where the first and second layers are two separate layers of an integrated circuit. The mask includes a mask substrate that is substantially completely transmissive to a first wavelength of light and a second wavelength of light. A layer of a first material is disposed on the mask substrate, where the first material is substantially opaque to the first wavelength of light. The layer of the first material is patterned for the first layer. A layer of a second material is disposed on the mask substrate, where the second material is substantially opaque to the second wavelength of light. The layer of the second material is patterned for the second layer, where the first layer and the second layer are aligned on the mask substrate.

Abstract: A method of printing an image on a wafer. The method includes the steps of printing a main image, wherein the main image includes fields which are fully on the wafer, and printing an alternate image, wherein the alternate image includes fields which are only partially on the wafer. The alternate image could be placed on a separate mask which is loaded onto the exposure tool after the mask with the main image has completed printing. Alternatively, it could be an extra image specially inserted on the mask with the main image for that layer.