Patents by Inventor Duane E. Whitson

Duane E. Whitson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making a header or housing for electrical connection to a hybrid circuit including an in-cavity trim of a terminal frame
    Patent number: 5359761
    Abstract: The present invention relates to a method of making a header or housing for connection to a semi-conductor device including the step of trimming a single terminal frame molded into the header while the header or housing is in the molding cavity. To accomplish this, the present invention utilizes a single terminal frame including a plurality of substantially parallel electrical connection fingers held together at one end by a tie-bar. The terminal frame has a "V-notch" in each of the electrical connection fingers at a location adjacent the tie-bar. The terminal frame is placed in a mold having an upper and lower mold shell each having cavities formed therein which together define the header or housing to be molded. The upper and lower mold shells come together and grasp the terminal frame at a position adjacent the notch and so that the tie-bar extends outwardly from the upper and lower mold shells.
    Type: Grant
    Filed: September 9, 1993
    Date of Patent: November 1, 1994
    Assignee: Delco Electronics Corp.
    Inventors: Duane E. Whitson, Daniel A. Lawlyes