Patents by Inventor Duane Eareckson

Duane Eareckson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7116760
    Abstract: In a system and method for determining the suitability of a copper pair line for xDSL service use, characteristic parameters of a copper pair line to be tested are measured. These characteristics include a wire gauge, length, and temperature of the copper pair line. In addition, characteristics such as the presence of short circuits, longitudinal balance, the presence of load coils, wideband noise and loop attenuation are tested for the copper pair line. A plant map of the copper pair line is then determined based on the measured and tested characteristics. Using the above characteristics and the plant map of the copper pair line, a transfer function representative of the plant map is determined which is then used to analyze and thereby qualify the copper pair line.
    Type: Grant
    Filed: December 4, 2000
    Date of Patent: October 3, 2006
    Assignee: Acterna, L.L.C.
    Inventors: David R. Smith, Richard Liberman, Duane Eareckson, David Johnson, Paul Francis Wyar
  • Publication number: 20020067802
    Abstract: In a system and method for determining the suitability of a copper pair line for xDSL service use, characteristic parameters of a copper pair line to be tested are measured. These characteristics include a wire gauge, length, and temperature of the copper pair line. In addition, characteristics such as the presence of short circuits, longitudinal balance, the presence of load coils, wideband noise and loop attenuation are tested for the copper pair line. A plant map of the copper pair line is then determined based on the measured and tested characteristics. Using the above characteristics and the plant map of the copper pair line, a transfer function representative of the plant map is determined which is then used to analyze and thereby qualify the copper pair line.
    Type: Application
    Filed: December 4, 2000
    Publication date: June 6, 2002
    Inventors: David R. Smith, Richard Liberman, Duane Eareckson, David Johnson, Paul Francis Wyar