Patents by Inventor Duane F. Card

Duane F. Card has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5632630
    Abstract: An optic module contains a flexible circuit board forming a cable which connects between an optical sub-assembly and a rigid interconnect structure within the optic module. The cable includes lands proximate to through holes for soldered connection to leads which extend from the optical sub-assemblies and are substantially smaller than the hole. A soldering bridge comprising several separate tabs equally spaced about the land and which project from the land into the hole and are very flexible in relation to the lead so that the lead can be placed in any radial position within the hole, but regardless of the position of the lead within the hole the projections of the soldering bridge project close enough to the lead so that during wave soldering a joint of desired configuration is produced. The soldering bridge can be integral with the land so that the bridge helps connect the solder to the land allowing the land to be smaller and thus providing for closer spacing between connection holes.
    Type: Grant
    Filed: October 19, 1995
    Date of Patent: May 27, 1997
    Assignee: International Business Machines Corporation
    Inventors: Duane F. Card, Eberhard S. Dittman, Mukund K. Saraiya
  • Patent number: 5295214
    Abstract: An optic module contains a flexible circuit board forming a cable which connects between an optical sub-assembly and a rigid interconnect structure within the optic module. The cable includes lands proximate to through holes for soldered connection to leads which extend from the optical sub-assemblies and are substantially smaller than the hole. A soldering bridge comprising several separate tabs equally spaced about the land and which project from the land into the hole and are very flexible in relation to the lead so that the lead can be placed in any radial position within the hole, but regardless of the position of the lead within the hole the projections of the soldering bridge project close enough to the lead so that during wave soldering a joint of desired configuration is produced. The soldering bridge can be integral with the land so that the bridge helps connect the solder to the land allowing the land to be smaller and thus providing for closer spacing between connection holes.
    Type: Grant
    Filed: November 16, 1992
    Date of Patent: March 15, 1994
    Assignee: International Business Machines Corporation
    Inventors: Duane F. Card, Eberhard S. Dittman, Mukund K. Saraiya