Abstract: A controller for a hot melt adhesive dispensing system has a main circuit board and power modules which are removably received on a controller enclosure. The power modules are directly couplable with the main board and with cord sets from heated hoses of the dispensing system, eliminating the need for wiring harnesses to be routed between these components. Accordingly, the main board and power modules may be readily removed and replaced in the field to permit efficient servicing and modification of the system to accommodate the needs of various applications.

Abstract: Applicators and dispensing systems for dispensing liquid hot melt adhesives and methods of dispensing liquid hot melt adhesives. The dispensing system supplies the liquid hot melt adhesive in a non-activated state to the applicator. The liquid hot melt adhesive is processed to modify at least one activation-sensitive property before dispensing onto a substrate. The property may exhibit a temperature dependence, in which case the applicator or other structure near the applicator heats the liquid hot melt adhesive immediately before application. The property may exhibit a pressure dependence, in which case the applicator or other structure near the application applies pressure and/or shear forces to the liquid hot melt adhesive shortly before dispensing. Alternatively, a property that is both temperature and pressure dependent may be modified.

Abstract: A controller for a hot melt adhesive dispensing system has a main circuit board and power modules which are removably received on a controller enclosure. The power modules are directly couplable with the main board and with cord sets from heated hoses of the dispensing system, eliminating the need for wiring harnesses to be routed between these components. Accordingly, the main board and power modules may be readily removed and replaced in the field to permit efficient servicing and modification of the system to accommodate the needs of various applications.