Abstract: A pair of spaced holes (32 and 34) are drilled in a substrate blank (10) diametrically along a line (14) defining a future locating edge (22) of a printed circuit board (12). When the substrate blank (10) is then sheared to form the printed circuit board (12), semi-circular recesses (38 and 40) are formed from the spaced holes (32 and 34) in the resultant board locating edge (22). The printed circuit board (12) then is accurately aligned in a processing station in X- and Y-directions by seating board-locating pins (50 and 52) of special configurations in respective ones of the semi-circular recesses (38 and 40).

Abstract: A component lead forming tool, having inside and outside lead formers, is provided with resilient "O" ring assemblies which permit horizontal lateral movement of the inside formers relative to the outside formers to allow leads of different lead diameters to be accurately formed. Each of the outside formers is formed with a longitudinal slot the depth of which equals the diameter of the smallest lead to be formed and received in the slot during a forming operation. The outside formers are movable vertically adjacent to the inside formers to bend and form the component lead over the inside formers. Horizontal lateral movement of the inside formers by virtue of the resiliency of the "O" rings permits a temporary increase in the distance between cooperating outside and inside formers when the diameter of the component lead to be formed is greater than the depth of the slot in each of the outside formers.