Patents by Inventor Duane S. Boning

Duane S. Boning has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10948394
    Abstract: The systems and methods of the present disclosure are directed to ultrasound-based concentration measurement techniques in which both scatterer count and image volume are measured concurrently to provide absolute concentration measurements. In particular, through the techniques of the present disclosure, the effective thickness of an ultrasound beam can be determined based on the spreading of individual scatterers within ultrasound images. Based on the effective thickness of the ultrasound beam, the volume of the image and, thus, the concentration of particles in the image can be determined directly, without the need for estimation, approximation, or use of a reference sample.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: March 16, 2021
    Assignee: Massachusetts Institute of Technology
    Inventors: John Haeseon Lee, Brian W. Anthony, Duane S. Boning
  • Publication number: 20200041400
    Abstract: The systems and methods of the present disclosure are directed to ultrasound-based concentration measurement techniques in which both scatterer count and image volume are measured concurrently to provide absolute concentration measurements. In particular, through the techniques of the present disclosure, the effective thickness of an ultrasound beam can be determined based on the spreading of individual scatterers within ultrasound images. Based on the effective thickness of the ultrasound beam, the volume of the image and, thus, the concentration of particles in the image can be determined directly, without the need for estimation, approximation, or use of a reference sample.
    Type: Application
    Filed: June 24, 2016
    Publication date: February 6, 2020
    Inventors: John Haeseon Lee, Brian W. Anthony, Duane S. Boning
  • Patent number: 8585954
    Abstract: A deformable body is embossed using a stamp as a function of a pressure distribution. The pressure distribution is obtained by running a deformation model determined based on convolving a contact pressure distribution with a mechanical response of a surface topography of the deformable body and convolving the pressure distribution with a point load response of the stamp.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: November 19, 2013
    Assignee: Massachusetts Institute of Technology
    Inventors: Hayden Kingsley Taylor, Duane S. Boning
  • Patent number: 8145457
    Abstract: Hot embossing may be more advantageous than other polymer microfabrication processes. An example embodiment of the present invention relates to a method and corresponding apparatus for developing a computationally inexpensive viscoelastic model for the hot embossing of complex patterns. These developed models may help engineers refine their selection of processing parameters based upon successive simulations of the embossing process. The example embodiment models deformation of a deformable body embossed with a stamp as a function of convolving a point-load-time response and a contact pressure distribution. In order to generate the point-load-time response, a time-dependent response of a surface of the thermoplastic to system inputs applied to an elemental region of the surface of the thermoplastic may be employed. The example embodiment generates an estimate of the contact pressure distribution as a function of the point-load-time response and an average pressure applied to the stamp.
    Type: Grant
    Filed: January 16, 2009
    Date of Patent: March 27, 2012
    Assignee: Massachusetts Institute of Technology
    Inventors: Hayden Kingsley Taylor, Duane S. Boning
  • Publication number: 20110187014
    Abstract: A deformable body is embossed using a stamp as a function of a pressure distribution. The pressure distribution is obtained by running a deformation model determined based on convolving a contact pressure distribution with a mechanical response of a surface topography of the deformable body and convolving the pressure distribution with a point load response of the stamp.
    Type: Application
    Filed: January 31, 2011
    Publication date: August 4, 2011
    Applicant: Massachusetts Institute of Technology
    Inventors: Hayden Kingsley Taylor, Duane S. Boning
  • Publication number: 20100076590
    Abstract: Hot embossing may be more advantageous than other polymer microfabrication processes. An example embodiment of the present invention relates to a method and corresponding apparatus for developing a computationally inexpensive viscoelastic model for the hot embossing of complex patterns. These developed models may help engineers refine their selection of processing parameters based upon successive simulations of the embossing process. The example embodiment models deformation of a deformable body embossed with a stamp as a function of convolving a point-load-time response and a contact pressure distribution. In order to generate the point-load-time response, a time-dependent response of a surface of the thermoplastic to system inputs applied to an elemental region of the surface of the thermoplastic may be employed. The example embodiment generates an estimate of the contact pressure distribution as a function of the point-load-time response and an average pressure applied to the stamp.
    Type: Application
    Filed: January 16, 2009
    Publication date: March 25, 2010
    Applicant: Massachusetts Institute of Technology
    Inventors: Hayden Kingsley Taylor, Duane S. Boning
  • Patent number: 6238571
    Abstract: A method for the removal of copper from waste waters includes providing a solution to be treated, the solution comprising copper; introducing a source of ferric ions and a source of ferrous ions into the solution; and adjusting the pH of the solution to promote formation of a copper-containing ferrite precipitate, whereby the solution is depleted in copper. In instances where the solution contains ferric ions, the method includes introducing a source of ferrous ions into the solution to obtain a solution comprising ferric ions and ferrous ions; and adjusting the pH of the solution to promote formation of a copper-containing ferrite precipitate, whereby the solution is depleted in copper.
    Type: Grant
    Filed: September 15, 1998
    Date of Patent: May 29, 2001
    Assignee: Massachusetts Institute of Technology
    Inventors: Ilhan Olmez, Francis X. Pink, Duran Karakas, Duane S. Boning
  • Patent number: 6153115
    Abstract: Plasma process analysis techniques are provided. The intensity of each of a number, P, of a plurality of radiation wavelengths that are emitted from a plasma process are monitored as the process proceeds. Indications of P-dimensional correlations between the intensities of the P monitored wavelengths are produced as the process proceeds. Then the produced correlation indications are compared with a prespecified correlation indication generated based on historical conditions for the plasma process, to determine the status condition of the process as the process proceeds. With this technique, the use of a priori, expected, specific templates is not required for evaluating radiation emission data during a plasma process. Instead the techniques investigate and discover the multiple complex correlations that form between various radiation emission wavelengths during a plasma process, and do not impose an expectation for a specific correlation or trend between the various wavelengths.
    Type: Grant
    Filed: October 23, 1997
    Date of Patent: November 28, 2000
    Assignee: Massachusetts Institute of Technology
    Inventors: Minh Le, Kuang Han Chen, Taber H. Smith, Duane S. Boning, Herbert H. Sawin