Abstract: A heat sink is for an element to be cooled has a thermally conductive base and a plurality of thermally conductive pins or fins extending substantially perpendicular from the base, said pins or fins being arranged in a predetermined pattern. The pins at least partially frame thermally conductive projections extending substantially perpendicular from said base which forming a discernable logo having an upper surface and sides for providing plural cooling surfaces. In this instance the 3-D logo performs cooling of the components within a package.

Abstract: A method of removing an optical device contained within a device package from a circuit board, wherein the device package is secured to the circuit board using an adhesive pad. The method includes peeling a portion of the adhesive pad away from the circuit board, inserting an optical removal tool between the optical device and the circuit board, wherein the optical removal tool has a pair of fork portions and a cavity positioned between the fork portions, and the fork portions straddle one or more leads on the optical device during the inserting step, and prying the remainder of the adhesive pad away from the circuit board using the optical device removal tool.

Abstract: A heat sink is for an element to be cooled has a thermally conductive base and a plurality of thermally conductive pins or fins extending substantially perpendicular from the base, said pins or fins being arranged in a predetermined pattern. The pins at least partially frame thermally conductive projections extending substantially perpendicular from said base which forming a discernable logo having an upper surface and sides for providing plural cooling surfaces. In this instance the 3-D logo performs cooling of the components within a package.

Abstract: A bend limiter configured to interface with an elongated optical fiber to limit bending of the optical fiber. The bend limiter includes an elongated spring having a spirally extending coil that at least partially defines an inner bore. The inner bore is adapted to accommodate the optical fiber such that the spirally extending coil extends coaxially around the optical fiber. The elongated spring provides bending resistance that limits the bending of the optical fiber. In one aspect, the outer diameter of the bend limiter (formed from an elongated spring) can be constructed much smaller than current bend limiter outer diameters for optical devices.

Abstract: An optical transmitter that includes a laser that operates in the range of 1260-1360 nm, wherein the laser is in a transmitter package case that covers less than 0.30 square inches of surface area on a board to which the package case is mounted, wherein the optical transmitter continues to function in compliance with the transmission requirements of international telecommunciations union (ITU) standard 693 without thermoelectric cooling when an external temperature of the transmitter package case is at or within 1° C. of a temperature of the laser.

Abstract: An apparatus for mounting an optical device includes an adhesive pad having two substantially planar faces coated with an adhesive that facilitates mounting the optical device to a circuit board so the optical device remains affixed through a range of operating temperature and pressures.

Abstract: A method of removing an optical device contained within a device package from a circuit board, wherein the device package is secured to the circuit board using an adhesive pad. The method includes peeling a portion of the adhesive pad away from the circuit board, inserting an optical removal tool between the optical device and the circuit board, wherein the optical removal tool has a pair of fork portions and a cavity positioned between the fork portions, and the fork portions straddle one or more leads on the optical device during the inserting step, and prying the remainder of the adhesive pad away from the circuit board using the optical device removal tool.

Abstract: The invention is an optoelectronic device including a semiconductor photodetector enclosed within a plastic housing. The housing includes a wall with an aperture therein for receiving optical signals. The photodetector is mounted to a flexible film which is, in turn, mounted to the housing so that the photodetector is aligned with the aperture. The device may further include a receptacle mounted to the wall for receiving an optical fiber aligned with the aperture and the photodetector.

Abstract: Systems and methods are used for automatic handling of optical fibers and transporting the same, as well as automatic assembly of the optical fibers into optical devices and transportation of the same. A spool facilitates handling, storing, and transporting of the optical fiber. A cassette receives an electronic module and the optical fiber, with or without a corresponding spool, and presents the fiber in a manner that facilitates automatic assembly of optical assemblies. The cassette also facilitates handling, storing, and transporting of the optical assemblies.