Patents by Inventor Duane T. Napp

Duane T. Napp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Component self alignment
    Patent number: 4836435
    Abstract: Alignment of leaded surface mount components to solder pads is enhanced by providing at least two soldered areas per lead, separated by a space of non-wettable material so that during component placement on the soldered areas there is a tendency for the components to self center as the leads fall between the raised soldered areas where they are retained during a reflow operation.
    Type: Grant
    Filed: June 6, 1988
    Date of Patent: June 6, 1989
    Assignee: International Business Machines Corporation
    Inventors: Duane T. Napp, Kevin J. Roche
  • Raw card fabrication process with nickel overplate
    Patent number: 4756795
    Abstract: A process for making printed circuit cards is disclosed wherein a copper clad, insulating substrate having a layer of copper from which circuitry lines and patterns will be fabricated, is coated with a thin layer of nickel prior to forming any circuit patterns.
    Type: Grant
    Filed: October 31, 1986
    Date of Patent: July 12, 1988
    Assignee: International Business Machines Corporation
    Inventors: Peter Bakos, Lawrence M. Baldauf, Duane T. Napp