Patents by Inventor DUANE WILCOXEN

DUANE WILCOXEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thinned semiconductor chip with edge support
    Patent number: 11251152
    Abstract: A semiconductor device with reduced device resistance is disclosed. The semiconductor device comprises a semiconductor chip in which the chip thickness at the center portion of the chip where the circuit elements are disposed is uniform and is different from the chip thickness near the chip sides distant from the circuit elements.
    Type: Grant
    Filed: March 12, 2020
    Date of Patent: February 15, 2022
    Assignee: DIODES INCORPORATED
    Inventors: Duane Wilcoxen, Chiao-Shun Chuang, Rain Liu, Thomas Tsai, Will Zhang
  • Thinned semiconductor chip with edge support
    Publication number: 20210288014
    Abstract: A semiconductor device with reduced device resistance is disclosed. The semiconductor device comprises a semiconductor chip in which the chip thickness at the center portion of the chip where the circuit elements are disposed is uniform and is different from the chip thickness near the chip sides distant from the circuit elements.
    Type: Application
    Filed: March 12, 2020
    Publication date: September 16, 2021
    Applicant: Diodes Incorporated
    Inventors: Duane Wilcoxen, Chiao-Shun Chuang, Rain Liu, Thomas Tsai, Will Zhang
  • WAFER LEVEL PACKAGING WITH HEAT DISSIPATION
    Publication number: 20110233756
    Abstract: A heat dissipating wafer level package and method for manufacturing a heat dissipating wafer level package is provided. The heat dissipating wafer level package has a thermally conductive coating integrated thereon which facilitates the dissipation of heat from a device into the surrounding air and/or the thermal transfer of heat away from the device toward a heat spreader or heat sink. Additionally, the coating enhances the structural integrity and strength of the wafer during the manufacturing process as well as the resulting WLP.
    Type: Application
    Filed: March 24, 2010
    Publication date: September 29, 2011
    Applicant: MAXIM INTEGRATED PRODUCTS, INC.
    Inventors: VIREN KHANDEKAR, ARKADII SAMOILOV, DUANE WILCOXEN, RICKY AGRAWAL