Patents by Inventor Duanliang CHENG

Duanliang CHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Array Imaging Module and Molded Photosensitive Assembly, Circuit Board Assembly and Manufacturing Methods Thereof for Electronic Device
    Publication number: 20170244877
    Abstract: An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.
    Type: Application
    Filed: March 15, 2017
    Publication date: August 24, 2017
    Inventors: Mingzhu WANG, Bojie ZHAO, Zhenyu CHEN, Takehiko TANAKA, Nan GUO, Zhen HUANG, Duanliang CHENG, Liang DING, Feifan CHEN, Heng JIANG