Abstract: The present disclosure relates to a display panel and a display device thereof. The display panel includes: a substrate; an organic light-emitting device located on the substrate; a cover layer located on the organic light-emitting device; a light extraction layer located on the cover layer; an optical functional layer located on the light extraction layer; and an encapsulation layer located on the optical functional layer. A refractive index of the light extraction layer is less than a refractive index of the cover layer and less than a refractive index of a portion of the encapsulation layer closest to the optical functional layer. A refractive index of the optical functional layer is less than the refractive index of the portion of the encapsulation layer closest to the optical functional layer and not equal to the refractive index of the light extraction layer.

Abstract: Provided are a light-emitting device and a manufacturing method thereof, and a display device, and relates to the field of display technology. The light-emitting device includes: a light-emitting unit located on one side of a backplane; and an encapsulation layer located on one side of the light-emitting unit away from the backplane. The encapsulation layer includes: a first inorganic layer; a second inorganic layer located on one side of the first inorganic layer away from the backplane; an organic layer located between the first inorganic layer and the second inorganic layer; and a third inorganic layer located between the first inorganic layer and the organic layer. The refractive index of the first inorganic layer, the refractive index of the third inorganic layer, and the refractive index of the organic layer decrease sequentially.

Abstract: The mask includes: a mask body provided with a shielding part configured to shield an IC region between two adjacent panels sharing a base substrate; and the shielding part includes a reinforcing portion and a thinned portion, and the thinned portion has an accommodating recess with an opening facing the base substrate to be configured to accommodate a driving IC in the IC region.

Abstract: An encapsulation method of a display panel, a display panel and a display device are disclosed. The encapsulation method of the display panel includes: forming at least one thin film encapsulation inorganic material layer on a thin film encapsulation region of a display substrate; forming a photoresist pattern on the at least one thin film encapsulation inorganic material layer; and etching the at least one thin film encapsulation inorganic material layer by using the photoresist pattern as a mask to form a thin film encapsulation inorganic layer including a first opening pattern.

Abstract: The disclosure relates to a display panel. The display panel may have a display area, a transition area, and a via hole area. The transition area may be between the via hole area and the display area. The display panel may include a substrate; an isolation structure on the substrate only in the transition area; and an encapsulation layer in both of the transition area and the display area. A first side surface of the isolation structure facing the via hole area may include a recess toward an interior of the isolation structure, and the encapsulation layer may include a cavity surrounding the isolation structure in the recess.

Abstract: The present disclosure provides a display panel, a method for packaging the same, and a display device. The display panel comprises a display substrate and at least one package film layer covering the display substrate, wherein the package film layer comprises a first inorganic film, a second inorganic film, an organic film and a third inorganic film laminated on the display substrate in sequence, wherein an adhesion between a material of the first inorganic film and a material of the organic film is less than an adhesion between a material of the second inorganic film and a material of the organic film.

Abstract: The disclosure relates to a display panel. The display panel may have a display area, a transition area, and a via hole area. The transition area may be between the via hole area and the display area. The display panel may include a substrate; an isolation structure on the substrate only in the transition area; and an encapsulation layer in both of the transition area and the display area. A first side surface of the isolation structure facing the via hole area may include a recess toward an interior of the isolation structure, and the encapsulation layer may include a cavity surrounding the isolation structure in the recess.

Abstract: An encapsulation method of a display panel, a display panel and a display device are disclosed. The encapsulation method of the display panel includes: forming at least one thin film encapsulation inorganic material layer on a thin film encapsulation region of a display substrate; forming a photoresist pattern on the at least one thin film encapsulation inorganic material layer; and etching the at least one thin film encapsulation inorganic material layer by using the photoresist pattern as a mask to form a thin film encapsulation inorganic layer including a first opening pattern.

Abstract: A vapor deposition apparatus, including: a reaction device having a reaction chamber; a first gas duct connected to the reaction chamber and configured to direct a process gas into the reaction chamber; a gas ionization device connected to the reaction device and configured to ionize a cleaning gas; and a second gas duct connected to the gas ionization device and configured to direct the cleaning gas into the gas ionization device; a common gas duct; and a three-way control mechanism. An end of the common gas duct is connected to the reaction chamber and the other end of the common gas duct is connected to a first gas port of the three-way control mechanism; the first gas duct and the gas ionization device are connected to a second gas port and a third gas port of the three-way control mechanism, respectively.

Abstract: A vapor deposition apparatus, including: a reaction device having a reaction chamber; a first gas duct connected to the reaction chamber and configured to direct a process gas into the reaction chamber; a gas ionization device connected to the reaction device and configured to ionize a cleaning gas; and a second gas duct connected to the gas ionization device and configured to direct the cleaning gas into the gas ionization device; a common gas duct; and a three-way control mechanism. An end of the common gas duct is connected to the reaction chamber and the other end of the common gas duct is connected to a first gas port of the three-way control mechanism; the first gas duct and the gas ionization device are connected to a second gas port and a third gas port of the three-way control mechanism, respectively.