Patents by Inventor Duanxin Li

Duanxin Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Suspension with supporting pieces, head gimbal assembly and disk drive unit with the same
    Patent number: 8582243
    Abstract: A suspension for a HGA comprises a flexure having a suspension tongue arranged for supporting a slider, which comprising a stainless steel layer and a dielectric layer formed thereon. The dielectric layer has a top surface and bottom surface, a plurality of bonding pads are formed on the top surface at a leading portion of the suspension tongue and arranged for connecting with the slider, and at least two separate supporting pieces are formed on the bottom surface and located at a corresponding position with the bonding pads, thereby releasing stress generated on the bonding pads. The invention also discloses a HGA and a disk drive unit with the same. The invention can release the stress generated on the bonding pads of the suspension, reduce the temperature impact to the suspension, and in turn, reduce thermal crown change of the slider, thereby improving the reading and writing performance.
    Type: Grant
    Filed: April 4, 2011
    Date of Patent: November 12, 2013
    Assignee: SAE Magentics (H.K.) Ltd.
    Inventors: Xianwen Feng, Kun Yi, Duanxin Li
  • Suspension with supporting pieces, head gimbal assembly and disk drive unit with the same
    Publication number: 20120170150
    Abstract: A suspension for a HGA comprises a flexure having a suspension tongue arranged for supporting a slider, which comprising a stainless steel layer and a dielectric layer formed thereon. The dielectric layer has a top surface and bottom surface, a plurality of bonding pads are formed on the top surface at a leading portion of the suspension tongue and arranged for connecting with the slider, and at least two separate supporting pieces are formed on the bottom surface and located at a corresponding position with the bonding pads, thereby releasing stress generated on the bonding pads. The invention also discloses a HGA and a disk drive unit with the same. The invention can release the stress generated on the bonding pads of the suspension, reduce the temperature impact to the suspension, and in turn, reduce thermal crown change of the slider, thereby improving the reading and writing performance.
    Type: Application
    Filed: April 4, 2011
    Publication date: July 5, 2012
    Applicant: SAE Magnetics (H.K.) Ltd.
    Inventors: Xianwen Feng, Kun Yi, Duanxin Li