Patents by Inventor Dubois Sébastien

Dubois Sébastien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8257996
    Abstract: The present invention relates to a method of fabricating a radiation detector comprising a photosensitive sensor assembly (1, 4), a scintillator (6) that converts the radiation into radiation to which the photosensitive sensor assembly (1, 4) is sensitive, the scintillator (6) being fastened by adhesive bonding to the sensor assembly, the sensor assembly comprising a substrate (4) and several attached sensors (1), the sensors (1) each having two faces (11, 12), a first face (11) of which is bonded to the substrate (4) and a second face (12) of which is bonded to the scintillator (6). The method consists in linking the following operations: the sensors (1) are deposited via their second face (12) on an adhesive film (13); and the sensors (1) are bonded via their first face (11) to the substrate (4).
    Type: Grant
    Filed: May 22, 2008
    Date of Patent: September 4, 2012
    Assignee: Trixell S.A.S.
    Inventors: Gérard Vieux, Jean-Michel Vignolle, Pierre Rohr, David Couder, Dubois Sébastien
  • Publication number: 20100291726
    Abstract: The present invention relates to a method of fabricating a radiation detector comprising a photosensitive sensor assembly (1, 4), a scintillator (6) that converts the radiation into radiation to which the photosensitive sensor assembly (1, 4) is sensitive, the scintillator (6) being fastened by adhesive bonding to the sensor assembly, the sensor assembly comprising a substrate (4) and several attached sensors (1), the sensors (1) each having two faces (11, 12), a first face (11) of which is bonded to the substrate (4) and a second face (12) of which is bonded to the scintillator (6). The method consists in linking the following operations: the sensors (1) are deposited via their second face (12) on an adhesive film (13); and the sensors (1) are bonded via their first face (11) to the substrate (4).
    Type: Application
    Filed: May 22, 2008
    Publication date: November 18, 2010
    Applicant: Trixell S.A.S.
    Inventors: Gerard Vieux, Jean-Michel Vignolle, Pierre Rohr, David Couder, Dubois Sebastien