Patents by Inventor Duc Su Yoo

Duc Su Yoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Shield cap and semiconductor package including shield cap
    Patent number: 6683795
    Abstract: A shield cap and a semiconductor package including a shield cap provide protection for passive components mounted on a substrate of a semiconductor package. The shield cap provides a means for manufacturing a semiconductor package that includes a semiconductor die and passive components without encapsulating the passive components within the encapsulation protecting the semiconductor die. The shield cap provides electromagnetic shielding and physical protection for the passive components and may provide thermal conduction from a semiconductor die by contacting the semiconductor die. The shield cap may be perforated to permit air circulation through the shield cap for providing improved thermal performance or may be a solid metal shield, providing improved electromagnetic shielding.
    Type: Grant
    Filed: April 10, 2002
    Date of Patent: January 27, 2004
    Assignee: Amkor Technology, Inc.
    Inventor: Duc Su Yoo