Patents by Inventor Duck-Kun Hwang

Duck-Kun Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HEAT ABSORB-RELEASE PLASTIC RESIN COMPOSITION AND MOLDED PRODUCT THEREOF
    Publication number: 20050176869
    Abstract: The present invention relates to a heat absorb-release plastic composition and a molded product thereof, more specifically to a heat absorb-release plastic resin composition, which can sense a temperature at a specific temperature, has flexural strength, and can absorb or release heat as a latent heat, and a molded product thereof. The heat absorb-release plastic resin composition absorbs heat at a desired temperature as a latent heat and thus temperature increase is small, and therefore, it can be used for automobile interior decoration material, housing for an electric home appliances, etc. even if it has comparatively low Heat deflection temperature.
    Type: Application
    Filed: February 11, 2004
    Publication date: August 11, 2005
    Inventors: Heon-Sang Lee, Ju-Hyung Lee, Kyung-Mo Park, Duck-Kun Hwang, Chong-Koo Kum, Eung-Soo Kim
  • Heat absorb-release plastic resin composition and molded product thereof
    Patent number: 6927249
    Abstract: The present invention relates to a heat absorb-release plastic composition and a molded product thereof, more specifically to a heat absorb-release plastic resin composition, which can sense a temperature at a specific temperature, has flexural strength, and can absorb or release heat as a latent heat, and a molded product thereof. The heat absorb-release plastic resin composition absorbs heat at a desired temperature as a latent heat and thus temperature increase is small, and therefore, it can be used for automobile interior decoration material, housing for an electric home appliances, etc. even if it has comparatively low Heat deflection temperature.
    Type: Grant
    Filed: February 11, 2004
    Date of Patent: August 9, 2005
    Assignee: LG Chem, Ltd.
    Inventors: Heon-Sang Lee, Ju-Hyung Lee, Kyung-Mo Park, Duck-Kun Hwang, Chong-Koo Kum, Eung-Soo Kim