Abstract: Disclosed is a method of forming a circuit pattern on a printed circuit board. More particularly, this invention relates to a method of forming a circuit pattern on a printed circuit board, including filling a grooved plate having grooves corresponding to a desired circuit pattern in the surface thereof with a conductive material and then bringing portions of the grooved plate sequentially into contact with the surface of the base substrate on which a circuit pattern is formed, to thus transfer the conductive material from the grooves to the surface of the base substrate, consequently forming the circuit pattern. Thereby, according to the method of this invention, a fine circuit pattern and a light, slim, short and small product, as well as a simple process, can be realized.

Abstract: Disclosed is a method of fabricating a package substrate using electroless nickel plating. The method includes preparing a base substrate, on which an internal layer circuit pattern is formed through a predetermined masking process; forming an insulating layer on the base substrate to achieve interlayer electric insulation; forming a first via hole through the insulating layer to achieve interlayer electric connection; forming a seed layer on the insulating layer through which the first via hole is formed; and forming an external layer circuit pattern on the seed layer through the other predetermined masking process. The seed layer is partially or selectively flash etched so as to prevent via open and undercut formed at the external layer circuit pattern.

Abstract: Disclosed herein is a method of manufacturing a package substrate with a fine circuit pattern using anodic oxidation. By anodizing a metal core which is opened through a masking process, oxidation layers are formed in open areas of the metal core to insulate portions of circuit pattern from each other. Further, by electroplating portions provided between the oxidation layers with copper or filling conductive paste between the oxidation layers using a screen, a package substrate having a fine circuit pattern is achieved.