Patents by Inventor Duck Won Moon

Duck Won Moon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate processing system and substrate transferring method
    Patent number: 9022714
    Abstract: A substrate processing system and substrate transferring method capable of transferring a substrate bi-directionally through the use of substrate transferring device provided between two rows of processing chambers arranged linearly, thereby improving the substrate-transferring efficiency, the substrate processing system includes a transfer chamber having at least one bi-directional substrate transferring device for bi-directionally transferring a substrate; and a plurality of processing chambers for applying a semiconductor-manufacturing process to the substrate, wherein the plurality of processing chambers are linearly arranged along two rows confronting each other, and the transfer chamber is interposed between the two rows of the processing chambers, wherein the bi-directional substrate transferring device have a moving unit inside the transfer chamber, and horizontally moved by a linear motor; and a bi-directional substrate transferring unit in the moving unit, the bi-directional substrate transferring u
    Type: Grant
    Filed: January 12, 2010
    Date of Patent: May 5, 2015
    Assignee: Jusung Engineering Co., Ltd.
    Inventors: Kyoo Hwan Lee, Duck Won Moon, Jae Wook Choi
  • Substrate Processing System and Substrate Transferring Method
    Publication number: 20110262252
    Abstract: A substrate processing system and substrate transferring method is disclosed, which is capable of transferring a substrate bi-directionally through the use of substrate transferring device provided between two rows of processing chambers arranged linearly, thereby improving the substrate-transferring efficiency, the substrate processing system comprising a transfer chamber having at least one bi-directional substrate transferring device for bi-directionally transferring a substrate; and a plurality of processing chambers for applying a semiconductor-manufacturing process to the substrate, wherein the plurality of processing chambers are linearly arranged along two rows confronting each other, and the transfer chamber is interposed between the two rows of the processing chambers, wherein the at least one bi-directional substrate transferring device comprises a moving unit provided inside the transfer chamber, and horizontally moved by a linear motor; and a bi-directional substrate transferring unit provided in
    Type: Application
    Filed: January 12, 2010
    Publication date: October 27, 2011
    Inventors: Kyoo Hwan Lee, Duck Won Moon, Jae Wook Choi