Patents by Inventor Due Huynh

Due Huynh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060091849
    Abstract: A modular battery pack includes a plurality of battery modules. Each battery module includes a plurality of cells disposed within a cell compartment that is hermetically sealed from a circuit compartment in the battery module. The liquid-impenetrable seal is achieved by insert molding tabs that electrically connect the cell compartment and the circuit compartment. Additionally, the lid of the battery module is ultrasonically welded to the battery module housing. The battery modules are placed into battery module compartments in a main housing, and couple to a main connector by way of a printed circuit board that couples the main connector to battery module connectors on each battery module. The pack ensures that any electrolyte that may leak from a cell does not compromise the electronic circuitry and associated components within the pack. Additionally, the fact that the pack can be separated into modules allows the pack to be shipped in conformity with applicable transportation and safety regulations.
    Type: Application
    Filed: November 1, 2004
    Publication date: May 4, 2006
    Inventors: Due Huynh, Ronald Torrence
  • Publication number: 20060024575
    Abstract: A sealed battery pack is provided that prevents liquid, dust and gas from compromising the reliability of the rechargeable cell and circuitry disposed within the pack. A rechargeable cell and printed circuit board are coupled together and are placed into a five sided housing. In one embodiment, one of the sides is longer that the others to accommodate electrical contacts for coupling to a host device. Once the cell/board assembly is positioned in the housing, plastic is drawn through the housing using an insert molding process to seal and encapsulate the cell and board within the housing. The seal provided by the insert molding process ensures that liquid, gas and dust do not penetrate the pack.
    Type: Application
    Filed: July 30, 2004
    Publication date: February 2, 2006
    Inventors: Andre Robinson, Due Huynh, James Robinson
  • Publication number: 20050183555
    Abstract: A machine for removing debris from an object, like a battery cell for example, is provided. The machine includes a means for holding the object, and a movable cutting member. The means for holding includes a fixed base and an adjustable, spring loaded loop or belt. One opens the belt by pulling a lever. The object is inserted until one side contacts a leveling plane. Once the object is inserted, another lever actuates a sliding block that causes the blade of the cutting member to slide across the side of the object, thereby shaving off any debris that may be on the object. Once the object is removed from the machine, the newly clean, shaven side is prepared so as to be suitable for manufacturing processes like welding.
    Type: Application
    Filed: February 20, 2004
    Publication date: August 25, 2005
    Inventors: Gabriel Santos, Russell Gyenes, Due Huynh
  • Publication number: 20050073283
    Abstract: A latch assembly for coupling a rechargeable battery to an electronic device is provided. The latch assembly includes an insertable latch having barbed wing members extending distally from a planar member. The planar member includes several features, including an insertion snap, a spring retention post and a mechanical stop. The latch is inserted into a latch aperture in a battery pack housing. The latch aperture includes a plurality of slots for receiving the various features of the latch. A spring, like a butterfly spring for example, provides an outward force between the latch and the housing. The latch assembly is designed for ease of manufacture, in that assembly is simply inserting the spring in the latch aperture and then snapping in the latch.
    Type: Application
    Filed: October 1, 2003
    Publication date: April 7, 2005
    Inventors: Charles Friedli, Due Huynh, William Kiger, Kevin Maggert
  • Patent number: 6084782
    Abstract: A substrate (200) to which a component (210) is mounted includes at least two mounting pads (215, 220) formed thereon for electrically coupling to a single terminal of the component (210) and for aligning the component (210) on the substrate (200) during a reflow operation.
    Type: Grant
    Filed: June 2, 1997
    Date of Patent: July 4, 2000
    Assignee: Motorola, Inc.
    Inventors: Due Huynh, Diann J. Beesch, Todd L. Smith
  • Patent number: 5726862
    Abstract: A leaded component (10) is provided with first and second leads (14 & 16). The leads are formed with stopping deviations (26 & 28) which prevent the leads from being inserted into a circuit board (38) beyond the stopping deviations. The leads may also be provided with retaining deviations (34 & 36) which function to retain the component on the circuit board. Further, the stopping deviations may be formed so as to indicate the polarity of a component, and finally, the stopping deviations may be provided with mounting portions (50 & 52) so that the leaded component may be surface mounted on a circuit board (54).
    Type: Grant
    Filed: February 2, 1996
    Date of Patent: March 10, 1998
    Assignee: Motorola, Inc.
    Inventors: Due Huynh, Thomas P. Kirby, Micheal M. Austin, John E. Herrmann
  • Patent number: 5720621
    Abstract: An electrical device (40) has a contact (58) for electrically interconnecting with a second device. The contact (58) is disposed on a rib (60) extending downward from the top of an upper housing (42) of the electrical device. The contact (58) has a cantilevered arm extending from a downward portion (68), and terminates in a contact head (78) which extend upwards through an opening (56). The downward portion (68) of the contact (58) has a contact point (72) for contacting an exposed conductor (50) deflectably mounted on a printed circuit board (46), which is disposed in a lower housing (44). When the upper and lower housings (42) and (44) are assembled together, the contact point (72) is pressed against the exposed conductor (50), deflecting it, and forming a gas tight solderless electrical connection.
    Type: Grant
    Filed: September 11, 1995
    Date of Patent: February 24, 1998
    Assignee: Motorola, Inc.
    Inventors: Michael M. Austin, Grant H. Lloyd, Due Huynh
  • Patent number: D391622
    Type: Grant
    Filed: April 23, 1997
    Date of Patent: March 3, 1998
    Assignee: Motorola, Inc.
    Inventors: Due Huynh, Willard F. Amero, Jr.