Patents by Inventor Duen-Huei HOU

Duen-Huei HOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230369334
    Abstract: A semiconductor device includes a first semiconductor fin that is formed over a substrate and extends along a first lateral axis. The semiconductor device includes a second semiconductor fin that is also formed over the substrate and extends along the first lateral axis. At least a tip portion of the first semiconductor fin and at least a tip portion of the second semiconductor fin bend toward each other along a second lateral axis that is perpendicular to the first lateral axis.
    Type: Application
    Filed: July 24, 2023
    Publication date: November 16, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Duen-Huei Hou, Tsu Hao Wang, Chao-Cheng Chen, Chun-Hung Lee, Hsin-Chih Chen, Kuo-Chin Liu
  • Patent number: 11774241
    Abstract: Embodiments disclosed herein relate generally to methods for measuring a characteristic of a substrate. In an embodiment, the method includes scanning over the substrate with a scanning probe microscope, the substrate having fins thereon, the scanning obtaining images showing respective fin top regions of the fins, the scanning probe microscope interacting with respective portions of sidewalls of the fins by a scanning probe oscillated during the scanning, selecting images obtained at a predetermined depth below the fin top regions to obtain a line edge profile of the fins, by a processor-based system, analyzing the line edge profile of the fins using power spectral density (PSD) method to obtain spatial frequency data of the line edge profile of the fins, and by the processor-based system, calculating line edge roughness of the fins based on the spatial frequency data.
    Type: Grant
    Filed: December 15, 2021
    Date of Patent: October 3, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei-Shan Hu, Dong Gui, Jang Jung Lee, Che-Liang Li, Duen-Huei Hou, Wen-Chung Liu
  • Patent number: 11749681
    Abstract: A semiconductor device includes a first semiconductor fin that is formed over a substrate and extends along a first lateral axis. The semiconductor device includes a second semiconductor fin that is also formed over the substrate and extends along the first lateral axis. At least a tip portion of the first semiconductor fin and at least a tip portion of the second semiconductor fin bend toward each other along a second lateral axis that is perpendicular to the first lateral axis.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: September 5, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Duen-Huei Hou, Chao-Cheng Chen, Chun-Hung Lee, Hsin-Chih Chen, Kuo-Chin Liu, J. H. Wang
  • Publication number: 20230269951
    Abstract: A semiconductor device includes a magnetic random access memory (MRAM) cell. The MRAM cell includes a first magnetic layer disposed over a substrate, a first non-magnetic material layer made of a non-magnetic material and disposed over the first magnetic layer, a second magnetic layer disposed over the first non-magnetic material layer, and a second non-magnetic material layer disposed over the second magnetic layer. The second magnetic layer includes a plurality of magnetic material pieces separated from each other.
    Type: Application
    Filed: April 24, 2023
    Publication date: August 24, 2023
    Inventors: Ji-Feng YING, Duen-Huei HOU
  • Patent number: 11659718
    Abstract: A semiconductor device includes a magnetic random access memory (MRAM) cell. The MRAM cell includes a first magnetic layer disposed over a substrate, a first non-magnetic material layer made of a non-magnetic material and disposed over the first magnetic layer, a second magnetic layer disposed over the first non-magnetic material layer, and a second non-magnetic material layer disposed over the second magnetic layer. The second magnetic layer includes a plurality of magnetic material pieces separated from each other.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: May 23, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ji-Feng Ying, Duen-Huei Hou
  • Publication number: 20230040346
    Abstract: A semiconductor device with different configurations of gate structures and a method of fabricating the same are disclosed. The semiconductor device includes a first gate structure and a second gate structure. The first gate structure includes a first interfacial oxide (IO) layer, a first high-K (HK) dielectric layer disposed on the first interfacial oxide layer, and a first dipole layer disposed at an interface between the first IL layer and the first HK dielectric layer. The HK dielectric layer includes a rare-earth metal dopant or an alkali metal dopant. The second gate structure includes a second IL layer, a second HK dielectric layer disposed on the second IL layer, and a second dipole layer disposed at an interface between the second IL layer and the second HK dielectric layer. The second HK dielectric layer includes a transition metal dopant and the rare-earth metal dopant or the alkali metal dopant.
    Type: Application
    Filed: March 22, 2022
    Publication date: February 9, 2023
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hsiang-Pi CHANG, Huang-Lin CHAO, Chung-Liang CHENG, Pinyen LIN, Chun-Chun LIN, Tzu-Li LEE, Yu-Chia LIANG, Duen-Huei HOU, Wen-Chung LIU, Chun-I WU
  • Publication number: 20220107179
    Abstract: Embodiments disclosed herein relate generally to methods for measuring a characteristic of a substrate. In an embodiment, the method includes scanning over the substrate with a scanning probe microscope, the substrate having fins thereon, the scanning obtaining images showing respective fin top regions of the fins, the scanning probe microscope interacting with respective portions of sidewalls of the fins by a scanning probe oscillated during the scanning, selecting images obtained at a predetermined depth below the fin top regions to obtain a line edge profile of the fins, by a processor-based system, analyzing the line edge profile of the fins using power spectral density (PSD) method to obtain spatial frequency data of the line edge profile of the fins, and by the processor-based system, calculating line edge roughness of the fins based on the spatial frequency data.
    Type: Application
    Filed: December 15, 2021
    Publication date: April 7, 2022
    Inventors: Wei-Shan HU, Dong GUI, Jang Jung LEE, Che-Liang LI, Duen-Huei HOU, Wen-Chung LIU
  • Patent number: 11244714
    Abstract: A method of writing to a magnetic random access memory cell includes applying an alternating current signal to the magnetic random access memory cell having a first magnetic orientation, and applying a direct current pulse to the magnetic random access memory cell to change the magnetic orientation of the magnetic random access memory cell from the first magnetic orientation to a second magnetic orientation. The first magnetic orientation and the second magnetic orientation are different.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: February 8, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ji-Feng Ying, Jhong-Sheng Wang, Duen-Huei Hou
  • Patent number: 11236996
    Abstract: Embodiments disclosed herein relate generally to methods for measuring a characteristic of a substrate. In an embodiment, the method includes scanning over the substrate with a scanning probe microscope, the substrate having fins thereon, the scanning obtaining images showing respective fin top regions of the fins, the scanning probe microscope interacting with respective portions of sidewalls of the fins by a scanning probe oscillated during the scanning, selecting images obtained at a predetermined depth below the fin top regions to obtain a line edge profile of the fins, by a processor-based system, analyzing the line edge profile of the fins using power spectral density (PSD) method to obtain spatial frequency data of the line edge profile of the fins, and by the processor-based system, calculating line edge roughness of the fins based on the spatial frequency data.
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: February 1, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei-Shan Hu, Dong Gui, Jang Jung Lee, Che-Liang Li, Duen-Huei Hou, Wen-Chung Liu
  • Publication number: 20210366909
    Abstract: A semiconductor device includes a first semiconductor fin that is formed over a substrate and extends along a first lateral axis. The semiconductor device includes a second semiconductor fin that is also formed over the substrate and extends along the first lateral axis. At least a tip portion of the first semiconductor fin and at least a tip portion of the second semiconductor fin bend toward each other along a second lateral axis that is perpendicular to the first lateral axis.
    Type: Application
    Filed: March 9, 2021
    Publication date: November 25, 2021
    Applicant: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Duen-Huei Hou, Chao-Cheng Chen, Chun-Hung Lee, Hsin-Chih Chen, Kuo-Chin Liu, J.H. Wang
  • Publication number: 20210265424
    Abstract: A semiconductor device includes a magnetic random access memory (MRAM) cell. The MRAM cell includes a first magnetic layer disposed over a substrate, a first non-magnetic material layer made of a non-magnetic material and disposed over the first magnetic layer, a second magnetic layer disposed over the first non-magnetic material layer, and a second non-magnetic material layer disposed over the second magnetic layer. The second magnetic layer includes a plurality of magnetic material pieces separated from each other.
    Type: Application
    Filed: May 10, 2021
    Publication date: August 26, 2021
    Inventors: Ji-Feng YING, Duen-Huei HOU
  • Publication number: 20210241809
    Abstract: A method of writing to a magnetic random access memory cell includes applying an alternating current signal to the magnetic random access memory cell having a first magnetic orientation, and applying a direct current pulse to the magnetic random access memory cell to change the magnetic orientation of the magnetic random access memory cell from the first magnetic orientation to a second magnetic orientation. The first magnetic orientation and the second magnetic orientation are different.
    Type: Application
    Filed: February 8, 2021
    Publication date: August 5, 2021
    Inventors: Ji-Feng YING, Jhong-Sheng WANG, Duen-Huei HOU
  • Patent number: 11004901
    Abstract: A semiconductor device includes a magnetic random access memory (MRAM) cell. The MRAM cell includes a first magnetic layer disposed over a substrate, a first non-magnetic material layer made of a non-magnetic material and disposed over the first magnetic layer, a second magnetic layer disposed over the first non-magnetic material layer, and a second non-magnetic material layer disposed over the second magnetic layer. The second magnetic layer includes a plurality of magnetic material pieces separated from each other.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: May 11, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ji-Feng Ying, Duen-Huei Hou
  • Patent number: 10916286
    Abstract: A method of writing to a magnetic random access memory cell includes applying an alternating current signal to the magnetic random access memory cell having a first magnetic orientation, and applying a direct current pulse to the magnetic random access memory cell to change the magnetic orientation of the magnetic random access memory cell from the first magnetic orientation to a second magnetic orientation. The first magnetic orientation and the second magnetic orientation are different.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: February 9, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ji-Feng Ying, Jhong-Sheng Wang, Duen-Huei Hou
  • Publication number: 20200340807
    Abstract: Embodiments disclosed herein relate generally to methods for measuring a characteristic of a substrate. In an embodiment, the method includes scanning over the substrate with a scanning probe microscope, the substrate having fins thereon, the scanning obtaining images showing respective fin top regions of the fins, the scanning probe microscope interacting with respective portions of sidewalls of the fins by a scanning probe oscillated during the scanning, selecting images obtained at a predetermined depth below the fin top regions to obtain a line edge profile of the fins, by a processor-based system, analyzing the line edge profile of the fins using power spectral density (PSD) method to obtain spatial frequency data of the line edge profile of the fins, and by the processor-based system, calculating line edge roughness of the fins based on the spatial frequency data.
    Type: Application
    Filed: July 13, 2020
    Publication date: October 29, 2020
    Inventors: Wei-Shan HU, Dong GUI, Jang Jung LEE, Che-Liang LI, Duen-Huei HOU, Wen-Chung LIU
  • Patent number: 10746542
    Abstract: Embodiments disclosed herein relate generally to methods for measuring a characteristic of a substrate. In an embodiment, the method includes scanning over the substrate with a scanning probe microscope, the substrate having fins thereon, the scanning obtaining images showing respective fin top regions of the fins, the scanning probe microscope interacting with respective portions of sidewalls of the fins by a scanning probe oscillated during the scanning, selecting images obtained at a predetermined depth below the fin top regions to obtain a line edge profile of the fins, by a processor-based system, analyzing the line edge profile of the fins using power spectral density (PSD) method to obtain spatial frequency data of the line edge profile of the fins, and by the processor-based system, calculating line edge roughness of the fins based on the spatial frequency data.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: August 18, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wei-Shan Hu, Dong Gui, Jang Jung Lee, Che-Liang Li, Duen-Huei Hou, Wen-Chung Liu
  • Publication number: 20200152701
    Abstract: A semiconductor device includes a magnetic random access memory (MRAM) cell. The MRAM cell includes a first magnetic layer disposed over a substrate, a first non-magnetic material layer made of a non-magnetic material and disposed over the first magnetic layer, a second magnetic layer disposed over the first non-magnetic material layer, and a second non-magnetic material layer disposed over the second magnetic layer. The second magnetic layer includes a plurality of magnetic material pieces separated from each other.
    Type: Application
    Filed: January 15, 2020
    Publication date: May 14, 2020
    Inventors: Ji-Feng YING, Duen-Huei HOU
  • Publication number: 20200096332
    Abstract: Embodiments disclosed herein relate generally to methods for measuring a characteristic of a substrate. In an embodiment, the method includes scanning over the substrate with a scanning probe microscope, the substrate having fins thereon, the scanning obtaining images showing respective fin top regions of the fins, the scanning probe microscope interacting with respective portions of sidewalls of the fins by a scanning probe oscillated during the scanning, selecting images obtained at a predetermined depth below the fin top regions to obtain a line edge profile of the fins, by a processor-based system, analyzing the line edge profile of the fins using power spectral density (PSD) method to obtain spatial frequency data of the line edge profile of the fins, and by the processor-based system, calculating line edge roughness of the fins based on the spatial frequency data.
    Type: Application
    Filed: March 22, 2019
    Publication date: March 26, 2020
    Inventors: Wei-Shan Hu, Dong Gui, Jang Jung Lee, Che-Liang Li, Duen-Huei Hou, Wen-Chung Liu
  • Publication number: 20200058340
    Abstract: A method of writing to a magnetic random access memory cell includes applying an alternating current signal to the magnetic random access memory cell having a first magnetic orientation, and applying a direct current pulse to the magnetic random access memory cell to change the magnetic orientation of the magnetic random access memory cell from the first magnetic orientation to a second magnetic orientation. The first magnetic orientation and the second magnetic orientation are different.
    Type: Application
    Filed: May 31, 2019
    Publication date: February 20, 2020
    Inventors: Ji-Feng YING, Jhong-Sheng WANG, Duen-Huei HOU
  • Patent number: 10541269
    Abstract: A semiconductor device includes a magnetic random access memory (MRAM) cell. The MRAM cell includes a first magnetic layer disposed over a substrate, a first non-magnetic material layer made of a non-magnetic material and disposed over the first magnetic layer, a second magnetic layer disposed over the first non-magnetic material layer, and a second non-magnetic material layer disposed over the second magnetic layer. The second magnetic layer includes a plurality of magnetic material pieces separated from each other.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: January 21, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ji-Feng Ying, Duen-Huei Hou