Abstract: A knife edge ring apparatus is provided for use during semiconductor manufacturing which includes a ring-shaped body having an inner side wall, an outer side wall and a top surface having a predetermined width. A multi-staged inclined portion is formed in the outer side wall and a plurality of discharge holes penetrate the body. Each of the discharge holes have an inlet associated therewith positioned at the inclined portion. The knife edge ring allows developer and cleaning solution to be discharged away from the wafer. A method of cleaning the bottom surface of a semiconductor wafer is also provided which employs the use of the knife edge ring. Developer is supplied onto the top surface of a wafer. Spraying solution is sprayed onto the bottom surface of the wafer.

Abstract: A knife edge ring apparatus is provided for use during semiconductor manufacturing which includes a ring-shaped body having an inner side wall, an outer side wall and a top surface having a predetermined width. A multi-staged inclined portion is formed in the outer side wall and a plurality of discharge holes penetrate the body. Each of the discharge holes have an inlet associated therewith positioned at the inclined portion. The knife edge ring allows developer and cleaning solution to be discharged away from the wafer. A method of cleaning the bottom surface of a semiconductor wafer is also provided which employs the use of the knife edge ring. Developer is supplied onto the top surface of a wafer. Spraying solution is sprayed onto the bottom surface of the wafer.

Abstract: A knife edge ring apparatus is provided for use during semiconductor manufacturing which includes a ring-shaped body having an inner side wall, an outer side wall and a top surface having a predetermined width. A multi-staged inclined portion is formed in the outer side wall and a plurality of discharge holes penetrate the body. Each of the discharge holes have an inlet associated therewith positioned at the inclined portion. The knife edge ring allows developer and cleaning solution to be discharged away from the wafer. A method of cleaning the bottom surface of a semiconductor wafer is also provided which employs the use of the knife edge ring. Developer is supplied onto the top surface of a wafer. Spraying solution is sprayed onto the bottom surface of the wafer.

Abstract: An air supply apparatus includes a buffer tank for receiving and storing ultra-pure water from an ultra-pure source, a temperature/humidity controller (THC) for conditioning the air using the ultra-pure water from the buffer tank, an ultra-pure water pipe for delivering the ultra-pure water from the ultra-pure source to the buffer tank, and an air pipe for delivering the air from the THC to semiconductor device fabricating equipment. A control mechanism, including at least one valve disposed in the piping of the apparatus, allows the apparatus to be selectively operated in a normal mode in which the ultra-pure water is allowed to flow from the ultra-pure water source to the THC via the buffer tank, and a cleaning mode in which the THC runs using ultra-pure water stored in the buffer tank while the ultra-pure water pipe is being cleaned.

Abstract: An air supply apparatus includes a buffer tank for receiving and storing ultra-pure water from an ultra-pure source, a temperature/humidity controller (THC) for conditioning the air using the ultra-pure water from the buffer tank, an ultra-pure water pipe for delivering the ultra-pure water from the ultra-pure source to the buffer tank, and an air pipe for delivering the air from the THC to semiconductor device fabricating equipment. A control mechanism, including at least one valve disposed in the piping of the apparatus, allows the apparatus to be selectively operated in a normal mode in which the ultra-pure water is allowed to flow from the ultra-pure water source to the THC via the buffer tank, and a cleaning mode in which the THC runs using ultra-pure water stored in the buffer tank while the ultra-pure water pipe is being cleaned.

Abstract: A chemical spray system includes a nozzle assembly and a suction pipe in flow communication with the nozzle assembly. A waste liquid tank is in flow communication with the suction pipe. A first valve assembly is located in a flow path of the suction pipe between the nozzle and the waste liquid tank. A generator, located in the flow path of the suction pipe between the first valve assembly and the waste liquid tank, induces fluid flow from the first valve assembly to the waste liquid tank. The nozzle assembly is suctioned via the suction pipe when the first valve assembly is in an open position. A cleansing fluid supply assembly is in flow communication with the suction pipe between the first valve assembly and the generator. Thus, a chemical can be cleaned from the generator with cleansing fluid to prevent corrosion and failure of the generator in advance.